T2525_06 Datasheet, PDF (9/12 Pages) ATMEL Corporation – IR Receiver ASSP

7. Chip Dimensions
Figure 7-1. Chip Size in µm
GND
351,904
IN
723,885
VS
63,660
T2525
T2525
1130,1030
scribe
63,70
OUT
0,0
Fusing
width
Note: Pad coordinates are for lower left corner of the pad in µm from the origin 0,0
Dimensions
Pad metallurgy
Finish
Length inclusive scribe
Width inclusive scribe
Thickness
Pads
Fusing pads
Material
Thickness
Material
Thickness
1.15 mm
1.29 mm
290µ ± 5%
90µ × 90µ
70µ × 70µ
AlCu/AlSiTi⁽¹⁾
0.8 µm
Si₃N₄/SiO₂
0.7/0.3 µm
Note: Value depends on manufacture location.
9
4657F–AUTO–10/06