AT89C51RB2 Datasheet, PDF (9/23 Pages) ATMEL Corporation – AT89C51RB2 / RC2 & T89C51IC2 QualPack

AT89C51RB2 / RC2 & T89C51IC2 QualPack
4.3 Wafer Level Reliability
4.3.1 Electromigration
Purpose:
To evaluate the AT56800, AT35500, and AT37000 processes for Metal 1, Metal 3 & Via Electromigration
Reliability.
Test Parameters:
Metal 1 & Metal 3:
Sample Size = 15
Temp = 250C with Joule heating .
J = 3.5E06 A/cm2.
Via:
Sample Size = 15
Temp = 200C with Joule heating.
J = 2.5E06 A/cm2.
Black’s Equation Parameters:
Failure Criteria - 10% increase in resistance. Data taken every 1% change.
n=2
Ea = 0.6eV
Lifetime Predictions:
Metal 1 :
Split 1 - Tf_{.1% exp} = ~ 28 hrs Tf_{.01% op} = ~ 28 hrs x 39706 accel = 127 years.
(Sigma = 2.7118 hours, Accel_temp = 130, Accel_current = 306)
Metal 3 :
Split 3 - Tf_{.1% exp} = ~ 140 hrs Tf_{.01% op} = ~ 140 hrs x 39706 accel = 634 years.
(Sigma = 1.8782 hours, Accel_temp = 130, Accel_current = 306)
VIA :
Split 4 - Tf_{.1% exp} = ~ 22 hrs Tf_{.1% op} = ~ 22 hrs x 7144 accel = 18 years.
(Sigma = 2.59 hours, Accel_temp = 31.75, Accel_current = 225) (9/15 fails)
Conclusion:
All splits pass the minimum 10 years lifetime.
Rev. 1 – 2002 June
9