AT34C02B_14 Datasheet, PDF (19/21 Pages) ATMEL Corporation – Hardware Write Protection for the Entire Array

8U3-1 – dBGA2
E
AT34C02B
D
1. b
PIN 1 BALL PAD CORNER
Top View
(d1)
PIN 1 BALL PAD CORNER
1
2
3
4
d
A₁
A₂
A
Side View
8
7
e
6
5
(e1)
Bottom View
8 SOLDER BALLS
1. This drawing is for general information only.
2. Dimension ‘b’ is measured at maximum solder ball diameter
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
A
A1
A2
b
D
E
e
e1
d
d1
MIN NOM MAX
0.71 0.81 0.91
0.10 0.15 0.20
0.40 0.45 0.50
0.20 0.25 0.30
1.50 BSC
2.00 BSC
0.50 BSC
0.25 REF
1.00 BSC
0.25 REF
NOTE
2
TITLE
1150 E. Cheyenne Mtn. Blvd. 8U3-1, 8-ball, 1.50 x 2.00 mm Body, 0.50 mm pitch,
R Colorado Springs, CO 80906 Small Die Ball Grid Array Package (dBGA2)
6/24/03
DRAWING NO. REV.
PO8U3-1
A
19
3417E–SEEPR–1/07