AT24CS01_14 Datasheet, PDF (17/23 Pages) ATMEL Corporation – Factory Programmed 128-bit Serial Number

13.
Ordering Information
Additional package types that are not listed may be available. Please contact Atmel for more details.
Atmel Ordering Code⁽¹⁾
Finish
Package
Voltage
Operation Range
AT24CS01-SSHM-B⁽²⁾
8S1
AT24CS01-SSHM-T⁽³⁾
AT24CS01-XHM-B⁽²⁾
AT24CS01-XHM-T⁽³⁾
AT24CS01-MAHM-T⁽³⁾
NiPdAu
(Lead-free/Halogen-free)
8X
8MA2
1.7V to 5.5V
Industrial Temperature
(-40C to +85C)
AT24CS01-STUM-T⁽³⁾
5TS1
AT24CS01-WWU11M⁽⁴⁾
—
Wafer Sale
AT24CS02-SSHM-B⁽²⁾
AT24CS02-SSHM-T⁽³⁾
AT24CS02-XHM-B⁽²⁾
AT24CS02-XHM-T⁽³⁾
AT24CS02-MAHM-T⁽³⁾
AT24CS02-STUM-T⁽³⁾
AT24CS02-WWU11M⁽⁴⁾
8S1
NiPdAu
8X
(Lead-free/Halogen-free)
8MA2
5TS1
—
Wafer Sale
1.7V to 5.5V
Industrial Temperature
(-40C to +85C)
Notes: 1. Consistent with the general semiconductor market trend, Atmel will supply devices with either gold or copper
bond wires to increase manufacturing flexibility and to ensure a long-term continuity of supply. There is no
difference in product quality, reliability, or performance between the two variations.
2. B = Bulk delivery in tubes.
 SOIC and TSSOP = 100 units per tube.
3. T = Tape and Reel
 SOIC = 4,000 units per reel.
 TSSOP, UDFN, and SOT23 = 5,000 units per reel.
4. For Wafer sales, please contact Atmel Sales.
8S1
8X
8MA2
5TS1
Package Type
8-lead, 0.150” wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 4.4mm body, Plastic Thin Shrink Small Outline (TSSOP)
8-pad, 2.00mm x 3.00mm body, 0.50mm pitch, Dual No Lead (UDFN)
5-lead, 2.90mm x 1.60mm body, Plastic Thin Shrink Small Outline (SOT23)
AT24CS01/02 [DATASHEET] 17
Atmel-8815D-SEEPROM-AT24CS01-02-Datasheet_082014