AT24C512_07 Datasheet, PDF (13/22 Pages) ATMEL Corporation – Two-wire Serial EEPROM

AT24C512
Ordering Information⁽¹⁾
Ordering Code
AT24C512C1-10CU-2.7⁽²⁾
AT24C512C1-10CU-1.8⁽²⁾
AT24C512-10PU-2.7⁽²⁾
AT24C512-10PU-1.8⁽²⁾
AT24C512W-10SU-2.7⁽²⁾
AT24C512W-10SU-1.8⁽²⁾
AT24C512N-10SU-2.7⁽²⁾
AT24C512N-10SU-1.8⁽²⁾
AT24C512-10TU-2.7⁽²⁾
AT24C512-10TU-1.8⁽²⁾
AT24C512Y4-10YU-1.8⁽²⁾
AT24C512U4-10UU-1.8⁽²⁾
AT24C512-W1.8-11⁽³⁾
Package
8CN1
8CN1
8P3
8P3
8S2
8S2
8S1
8S1
8A2
8A2
8Y4
8U4-1
Die Sale
Operation Range
Lead-free/Halogen-free/
Industrial Temperature
(–40°C to 85°C)
Industrial Temperature
(–40°C to 85°C)
Notes:
1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics
tables.
2. “U” designates Green package + RoHS compliant.
3. Available in waffle pack and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request. Please
contact Serial EEPROM marketing.
8CN1
8P3
8S2
8S1
8A2
8Y4
8U4-1
–2.7
–1.8
Package Type
8-lead, 0.300" Wide, Leadless Array Package (LAP)
8-lead, 0.300" Wide, Plastic Dual In-line Package (PDIP)
8-lead, 0.200” Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)
8-lead, 0.150” Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-lead, 6.00 mm x 4.90 mm Body, Dual Footprint, Non-leaded, Small Array Package (SAP)
8-ball, die Ball Grid Array Package (dBGA2)
Options
Low-voltage (2.7V to 5.5V)
Low-voltage (1.8V to 3.6V)
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