ATA6663_14 Datasheet, PDF (10/19 Pages) ATMEL Corporation – LIN Transceiver

5. Thermal Characteristics DFN8
Parameters
Symbol
Min.
Typ.
Max.
Unit
Thermal resistance junction to heat slug
R_thJC
10
K/W
Thermal resistance junction to ambient, where heat slug is
soldered to PCB according to JEDEC
R_thJA
50
K/W
Thermal shutdown
Thermal shutdown hysteresis
T_off
150
165
180
°C
T_hys
5
10
20
°C
6. Electrical Characteristics
5V < V_S < 27V, T_j = –40°C to +150°C
No. Parameters
Test Conditions
Pin Symbol Min. Typ. Max.
1 V_S Pin
1.1 DC voltage range nominal
Sleep mode
1.2 Supply current in sleep mode
V_LIN > V_S – 0.5V
V_S < 14V
Sleep mode,
bus shorted to GND
V_LIN = 0V
V_S < 14V
1.3
Bus recessive
V_S < 14V
Supply current in normal mode _{Bus dominant}
1.4
V_S < 14V
Total bus load > 500Ω
7
V_S
7
I_VSsleep
5
13.5 27
10
20
7
I_{VSsleep_sc}
7
I_VSrec
7
I_VSdom
23
45
0.9 1.3
1.2
2
1.5
Supply current in fail-safe mode
Bus recessive
V_S < 14V
1.6 V_S undervoltage threshold on
1.7 V_S undervoltage threshold off
1.8
V_S undervoltage threshold
hysteresis
7
I_VSfail
0.5
7
V_Sth
4
7
V_Sth
4.05
7
V_{Sth_hys}
50
1.1
4.95
5
500
2 RXD Output Pin (Open Drain)
2.1 Low-level output sink current
2.2 RXD saturation voltage
2.3 High-level leakage current
2.4 ESD Zener diode
3 TXD Input Pin
Normal mode
V_LIN = 0V, V_RXD = 0.4V
5-kΩ pull-up resistor to 5V
Normal mode
V_LIN = V_BAT, V_RXD = 5V
I_RXD = 100µA
1
I_RXDL
1.3
2.5
8
1
Vsat_RXD
0.4
1
I_RXDH
–3
+3
1
VZ_RXD
5.8
8.6
3.1 Low-level voltage input
4
V_TXDL
–0.3
+0.8
3.2 High-level voltage input
4
V_TXDH
2
5.5
3.3 Pull-down resistor
V_TXD = 5V
4
R_TXD
125 250 600
3.4 Low-level leakage current
V_TXD = 0V
4
I_{TXD_leak}
–3
+3
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Unit
V
µA
µA
mA
mA
mA
V
V
mV
mA
V
µA
V
V
V
kΩ
µA
Type*
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
10 ATA6663/ATA6664 [DATASHEET]
9146I–AUTO–10/14