AT17N256_07 Datasheet, PDF (10/18 Pages) ATMEL Corporation – FPGA Configuration Memory

Thermal Resistance Coefficients⁽¹⁾
Package Type
8P3 Plastic Dual Inline Package
(PDIP)
8S1 Plastic Gull Wing Small Outline
(SOIC)
20S2
Plastic Gull Wing Small Outline
(SOIC)
44A Thin Plastic Quad Flat
Package (TQFP)
θ_JC [°C/W]
θ_JA
[°C/W]⁽²⁾
θ_JC [°C/W]
θ_JA
[°C/W]⁽²⁾
θ_JC [°C/W]
θ_JA
[°C/W]⁽²⁾
θ_JC [°C/W]
θ_JA
[°C/W]⁽²⁾
AT17N256
37
107
45
150
–
–
AT17N512/
AT17N010
37
107
–
–
–
–
AT17N002
–
–
–
–
17
62
AT17N040
–
–
–
–
–
–
17
62
Notes: 1. For more information refer to the “Thermal Characteristics of Atmel’s Packages”, available on the Atmel web site.
2. Airflow = 0 ft/min.
10 AT17N256/512/010/002/040
3020C–CNFG–08/07