FCD4B14 Datasheet, PDF (1/20 Pages) ATMEL Corporation – Thermal Fingerprint Sensor with 0.4 mm x 14 mm Sensing Area and Digital Output

Features
• Sensitive Layer Over a 0.8 µm CMOS Array
• Image Zone: 0.4 x 14 mm = 0.02" x 0.55"
• Image Array: 8 x 280 = 2240 pixels
• Pixel Pitch: 50 µm x 50 µm = 500 dpi
• Pixel Clock: up to 2 MHz Enabling up to 1780 Frames per Second
• Die Size: 1.7 x 17.3 mm
• Operating Voltage: 3V to 5.5V
• Naturally Protected Against ESD: > 16 kV Air Discharge
• Power Consumption: 20 mW at 3.3V, 1 MHz, 25°C
• Operating Temperature Range: 0°C to +70°C: C suffix
• Resistant to Abrasion: >1 Million Finger Sweeps
• Chip-On-Board (COB) package or 20-lead Ceramic DIP available for development, with
Specific Protective Layer
Applications
• PDA (Access Control, Data Protection)
• Cellular Phones, SmartPhone (Access e-business)
• Notebook, PC-add on (Access Control, e-business)
• PIN Code Replacement
• Automated Teller Machine, POS
• Building Access
• Electronic Keys (Cars, Home,...)
• Portable Fingerprint Imaging for Law Enforcement
• TV Access
Figure 1. Fingerchip Packages
Step for easy
integration
Sensing area
Wire protection
(not drawn)
Chip-on-Board Package
(COB)
Thermal
Fingerprint
Sensor with
0.4 mm x 14 mm
(0.02" x 0.55")
Sensing Area
and
Digital Output
(On-chip ADC)
FCD4B14
FingerChip^™
20-pin, 0.3" Dual-Inline
Ceramic Package
(DIP20)
Rev. 1962C–01/02
1