AUG15W Datasheet, PDF (15/15 Pages) Astec America, Inc – Ultra Low Profile DC - DC Module (Pb-free reflow compatible and ROHS Compliant)

Technical Reference Note
Ultra Low Profile
AUG 15W Series
Reflow Soldering Information
Soldering
I) Flux
Solder the products with Rosin Flux (0.2wt%. chloride or less).
Do not use acid or soluble flux, because they may damage metallic parts and glass
parts and may cause defective or reduce quality.
II) Solder
SnAgCu solder compatible
III) Condition of Soldering – Recommended soldering profile (J-STD-020C):
Reflow Profile :
Infrared or air blow
Preheating
:
150 – 200 deg C for 60 to 150sec
Peak temperature :
240 ± 5 deg C at surface.
Maximum period above 220deg.C :
20 – 60sec
Ramp rate
:
lower than 4 deg C / sec
Recommendation
Do not give vibration to products while solder melts under reflow process.
Please handle to wait for products cooled down enough.
Please don’t reflow a motherboard mounted the products on the lower side such as a
below figure, because the products surely fall down from the motherboard.
If need, we recommend to use supplemental mechanical contact to pins at four
corners of a substrate by other adhesive methods, for example, a thermal setting
resin rather than soldering.
Motherboard
Isolated DC-DC converter
Recommend Storage Condition
Maximum storage period:
Storage condition:
6 months
30 deg C, 60%RH
Recommend baking the module at 100degC for 24 hours if storage period is longer than 6 months.
MODEL : AUG 15W SERIES
April 05 REVISION 02
SHEET 15 OF 15