ASL51S9_17 Datasheet, PDF (7/8 Pages) Advanced Semiconductor Business Inc. – High Gain, Low Noise Amplifier

ASL51S9
4. Package Outline (SOT89, 4.5x4.0x1.5 mm)
ASL51S9
Pxxxx
Part No.
Lot No.
Symbols
Dimensions (In mm)
MIN
NOM
MAX
A
1.40
1.50
1.60
L
0.89
1.04
1.20
b
0.36
0.42
0.48
b1
0.41
0.47
0.53
C
0.38
0.40
0.43
D
4.40
4.50
4.60
D1
1.40
1.60
1.75
E
3.64
---
4.25
E1
2.40
2.50
2.60
e1
2.90
3.00
3.10
H
0.35
0.40
0.45
S
0.65
0.75
0.85
e
1.40
1.50
1.60
5. Surface Mount Recommendation (In mm)
NOTE
1. The number and size of ground via holes in a circuit
board are critical for thermal and RF grounding
considerations.
2. Recommended is that the ground via holes be
placed on the bottom of the lead pin 2 and exposed
pad of the device for better RF and thermal
performance, as shown in the drawing at the left
side.
7/8
ASB Inc.  [e-mail]
January 2017