IC-LSC_13 Datasheet, PDF (4/8 Pages) IC-Haus GmbH – 12-CHANNEL ACTIVE PHOTOSENSOR ARRAY

iC-LSC
12-CHANNEL ACTIVE PHOTOSENSOR ARRAY
Rev C3, Page 4/8
PACKAGE DIMENSIONS oQFN32-5x5
All dimensions given in mm.
Maximum molding excess +20 µm / -75 µm versus surface of glass/reticle.
Maximum package thickness tolerance +/- 0.1 mm.
RECOMMENDED PCB-FOOTPRINT
4.90
3.60
R0.15
SIDE
0.50
0.30
TOP
BOTTOM
5
3.60
1.84
0.50
0.23
drb_lsc-oqfn32-2_pack_1, 10:1