ALN1730WB Datasheet, PDF (2/4 Pages) Advanced Semiconductor Business Inc. – Internally Matched LNA Module

Application Circuit
IN
ALN1730WB
Internally Matched LNA Module
VS
+-
Tantal or MLC (Multi Layer Ceramic)
Capacitor
C1
C2
ALN1730WB
OUT
1) The tantal or MLC (Multi Layer Ceramic) capacitor is optional and for bypassing the AC noise introduced from the DC supply. The ca
pacitance value may be determined by customer’s DC supply status. The capacitor should be placed as close as possible to Vs pin
and be connected directly to the ground plane for the best electrical performance.
2) DC blocking capacitors are always necessarily placed at the input and output port for allowing only the RF signal to pass and blockin
g the DC component in the signal. The DC blocking capacitors are included inside the ALN module. Therefore, C1 & C2 capacitors
may not be necessary, but can be added just in case that the customer wants. The value of C1 & C2 is determined by considering t
he application frequency.
Outline Drawing (Unit: mm)
plerow
ALN1730WB
(Top View)
Solder Stencil Area
(Bottom View)
(Side View)
Ø 0.4 plated thru holes to ground plane
(Recommended Footprint)
Pin Number
2
5
6
Others
Function
RF In
RF Out
Vs
Ground
Note: 1. The number and size of ground via holes in a
circuit board is critical for thermal RF grounding
considerations.
2. We recommend that the ground via holes
be placed on the bottom of all ground pi
ns for better RF and thermal performanc
e, as shown in the drawing at the left sid
e.
2/4
ASB Inc.  [e-mail]  Tel: [phone]
Apr 2013