ASX0837HG Datasheet, PDF (13/14 Pages) Advanced Semiconductor Business Inc. – X Band Power Amplifier MMIC

ASX0837HG
4. Mounting Instructions for Flange Package
4.1 Screw Mounting
4.1.1 The flange of package should be attached using screws. Torque conditions are shown in table 1.
Table 1. Recommended and Maximum Torque for Screw Mounting
Package
Recommended
Screw
Recommended
Torque
Maximum Torque
Flange
M2.0
10 N-cm (0.9 lb-in)
15 N-cm (1.3 lb-in)
4.1.2 First, tighten the screws with a torque driver set to 5 N-cm
4.1.3 The surface finish of the heat sinker should be better than 0.8 µm and the surface flatness must
be better than 10 µm.
4.1.4 Silicon based heat sink compounds should not be used for the thermal conductive grease. It
causes the poor grounding of the source flange, contamination, and long term degradation of
thermal resistance between the package and heat sinker.
4.2. Solder Mounting
4.2.1 Recommended solder is lead-free solder (Sn-3.0Ag-0.5Cu) or equivalent.
4.2.2 After soldering, the flux residue should be removed by appropriate cleaning methods.
4.2.3 The recommended soldering conditions are as follows:
Partial heating method: Soldering iron, spot laser/air
Product terminal temperature: 260°C, max. 10 sec/terminal or 400°C, max. 3 sec/terminal
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ASB Inc.  [e-mail]
June 2017