APM0923-P29_13 Datasheet, PDF (1/5 Pages) Advanced Semiconductor Business Inc. – High OIP3 Medium Power Amplifier Module

Features
· S21 = 33.05 dB @ 920 MHz
= 32.95 dB @ 925 MHz
· NF of 6.5 dB over Frequency
· Unconditionally Stable
· Single 5V Supply
· High OIP3 @ Low Current
plerow^TM APM0923-P29
High OIP3
Medium Power Amplifier Module
Description
The plerow^TM APM-Series is an internally matched
amplifier mini-module for such application band in
SMD package with the output P1dB of 29 dBm. It is
compactly designed for low current consumption and
high OIP3. Integrating all the components for biasing
and matching within the module enhances production
yield and throughput as well. It passes through the
stringent DC, RF, and reliability tests. Not sample test
but 100% quality control test is made before packing.
Specifications (in Production)
Typ. @ T = 25C, Vs = 5 V, Freq. = 922.5 MHz, Zo.sys = 50 ohm
Parameter
Specifications
Unit
Min
Typ
Max
Frequency Range
MHz
920
925
Gain
dB
32.0
33.0
Gain Flatness
dB
 0.05
 0.1
Noise Figure
dB
6.5
7.0
Output IP3 ⁽¹⁾
dBm
45.5
48.5
S11 / S22 ⁽²⁾
dB
-19 / -10
Output P1dB
dBm
29
30
Switching Time ⁽³⁾
sec
-
Supply Current
mA
380
400
Supply Voltage
V
5
Impedance

50
Max. RF Input Power
dBm
C.W 23 ~ 25 (before fail)
Package Type & Size
mm
Surface Mount Type, 10Wx10Lx3.8H
Operating temperature is -40C to +85C.
1) OIP3 is measured with two tones at an output power of 12 dBm / tone separated by 1 MHz.
2) S11/S22 (max) is the worst value within the frequency band.
3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS.
Outline Drawing (Unit: mm)
1-stage Single Type
More Information
Website: www.asb.co.kr
E-mail: [e-mail]
Tel: [phone]
Fax: [phone]
plerow
APM0923-P29
ASB Inc.
(Top View)
Solder Stencil Area
(Side View)
Ø 0.3 plated thru holes to ground plane
1/5
(Bottom View)
Pin Number
Function
2
RF In
5
RF Out
6
Vs
Others
Ground
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
2 x Ø 2.0 plated thru holes to screw on heat sinker
(Recommended Footprint)
www.asb.co.kr
April 2009