APM0400-P33 Datasheet, PDF (1/4 Pages) Advanced Semiconductor Business Inc. – Low Noise and High OIP3 Medium Power Amplifier Module

Features
· S21 = 19.7 dB@380 MHz
= 18.3 dB@420 MHz
· NF fo 10.0 dB over Frequency
· Unconditionally Stable
· Single 5.4 V Supply
· High OIP3@Low Current
plerow^TM APM0400-P33
Low Noise & High OIP3
Medium Power Amplifier Module
Description
APM0400-P33 is an internally matched amplifier mini-
module for such application band in SMD package
with the output P1dB of 33 dBm. It is compactly de-
signed for low current consumption and high OIP3.
Integrating all the components for biasing and match-
ing within the module enhances production yield and
throughput as well. It passes through the stringent
DC, RF, and reliability tests. Not sample test but 100%
quality control test is made before packing.
Specifications (in Production)
Typ.@T = 25 C, Vs = 5.4 V, Freq. = 400 MHz, Zo.sys = 50 ohms
Parameter
Specifications
Unit
Min
Typ
Max
Frequency Range
MHz
380
420
Gain
dB
18
19
Gain Flatness
dB
0.7
0.8
Noise Figure
Output IP3 ⁽¹⁾
S11/S22 ⁽²⁾
dB
10
11
dBm
44
47
dB
-10/-12
Output P1dB
Switching Time ⁽³⁾
Supply Current
dBm
sec
mA
32
33
-
600
700
Supply Voltage
V
5.4
Impedance
Max. RF Input Power

dBm
50
C.W 23 ~ 25 (before fail)
Package Type & Size
mm
Surface Mount Type, 13Wx13Lx3.8H
Operating temperature is –40 C to +85 C.
1) OIP3 is measured with two tones at an output power of 18 dBm/tone separated by 1 MHz.
2) S11, S22 (max) is the worst value within the frequency band.
3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS.
Outline Drawing (Unit: mm)
2-stage Single Type
More Information
Website: www.asb.co.kr
E-mail: [e-mail]
Tel: [phone]
Fax: [phone]
ASB Inc., 4th Fl. Venture Town
Bldg., 367-17 Goijeong-Dong,
Seo-Gu, Daejon 302-716, Korea
plerow
APM0400-P33
ASB Inc.
(Top View)
Solder Stencil Area
(Side View)
Ø0.3 plated thru holes to ground plane
1/4
(Bottom View)
Pin Number
3
8
10
Others
Function
RF In
RF Out
Vs
Ground
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
2 x Ø2.0 plated thru holes to screw on heat sinker
(Recommended Footprint)
www.asb.co.kr
October 2009