ALN1970T2_17 Datasheet, PDF (1/3 Pages) Advanced Semiconductor Business Inc. – Internally Matched LNA Module

plerow^TM ALN1970T2
Internally Matched LNA Module
Features
· S21 = 29.1 dB @ 1960 MHz
= 28.9 dB @ 1980 MHz
· NF of 0.65 dB over Frequency
· Unconditionally Stable
· Single 5V Supply
· High OIP3 @ Low Current
Description
The plerow^TM ALN-series is the compactly designed surface-mount
module for the use of the LNA with or without the following gain blocks in
the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS,
PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communi-
cation terminals, CATV and so on. It has an exceptional performance of
low noise figure, high gain, high OIP3, and low bias current. The stability
factor is always kept more than unity over the application band in order
to ensure its unconditionally stable implementation to the application
system environment. The surface-mount module package including the
completed matching circuit and other components necessary just in case
allows very simple and convenient implementation onto the system
board in mass production level.
Specifications (in Production)
Typ. @ T = 25C, Vs = 5 V, Freq. = 1970 MHz, Zo.sys = 50 ohm
Parameter
Specifications
Unit
Min
Typ
Max
Frequency Range
MHz
1960
1980
Gain
dB
28
29
Gain Flatness
dB
 0.1
 0.2
Noise Figure
dB
0.65
0.70
Output IP3 ⁽¹⁾
dBm
32
33
S11 / S22 ⁽²⁾
dB
-18 / -15
Output P1dB
dBm
16
17
Switching Time ⁽³⁾
sec
-
Supply Current
mA
90
100
Supply Voltage
V
5
Impedance

50
Package Type & Size
mm
Surface Mount Type, 10Wx10Lx3.8H
Operating temperature is -40C to +85C.
1) OIP3 is measured with two tones at an output power of 5 dBm / tone separated by 1 MHz.
2) S11/S22 (max) is the worst value within the frequency band.
3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS.
2-stage Single Type
More Information
Website: www.asb.co.kr
E-mail: [e-mail]
Tel: [phone]
Fax: [phone]
Outline Drawing (Unit: mm)
plerow
ALN1970T2
ASB Inc.
(Top View)
Solder Stencil Area
(Bottom View)
(Side View)
Ø 0.4 plated thru holes to ground plane
1/3
(Recommended Footprint)
www.asb.co.kr
Pin Number
2
5
6
Others
Function
RF In
RF Out
+Vcc
Ground
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
July 2017