ALN1953_17 Datasheet, PDF (1/3 Pages) Advanced Semiconductor Business Inc. – Internally Matched LNA Module

plerow^TM ALN1953
Internally Matched LNA Module
Features
· 29 dB Gain at 1950 MHz
· 21 dBm P1dB
· 34 dBm Output IP3
· 0.65 dB Noise Figure
· Operating at Single 5 V Supply
· 100 mA Current Consumption
Description
The plerow^TM ALN-series is the compactly designed surface-mount
module for the use of the LNA with or without the following gain blocks in
the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS,
PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communi-
cation terminals, CATV and so on. It has an exceptional performance of
low noise figure, high gain, high OIP3, and low bias current. The stability
factor is always kept more than unity over the application band in order
to ensure its unconditionally stable implementation to the application
system environment. The surface-mount module package including the
completed matching circuit and other components necessary just in case
allows very simple and convenient implementation onto the system
board in mass production level.
Specifications (in Production)
Typ. @ T = 25C, Vs = 5 V, Freq. =1950 MHz, Zo.sys = 50 ohm
Parameter
Specifications
Unit
Min
Typ
Max
Frequency Range
MHz
1940
1960
Gain
dB
28
29
Gain Flatness
dB
 0.1
 0.2
Noise Figure
dB
0.65
0.75
Output IP3 ⁽¹⁾
dBm
33
34
S11 / S22 ⁽²⁾
dB
-18 / -10
Output P1dB
dBm
20
21
Switching Time ⁽³⁾
sec
-
Supply Current
mA
100
120
Supply Voltage
V
5
Impedance

50
Package Type & Size
mm
Surface Mount Type, 13Wx13Lx3.8H
Operating temperature is -40C to +85C.
1) OIP3 is measured with two tones at an output power of 7 dBm / tone separated by 1 MHz.
2) S11/S22 (max) is the worst value within the frequency band.
3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS.
2-stage Single Type
More Information
Website: www.asb.co.kr
E-mail: [e-mail]
Tel: [phone]
Fax: [phone]
Outline Drawing (Unit: mm)
plerow
ALN1953
ASB Inc.
(Top View)
Solder Stencil Area
(Side View)
(Bottom View)
Pin Number
3
8
10
Others
Function
RF In
RF Out
+Vcc
Ground
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
Ø 0.4 plated thru holes to ground plane
1/3
(Recommended Footprint)
www.asb.co.kr
July 2017