ALN1883T2_13 Datasheet, PDF (1/4 Pages) Advanced Semiconductor Business Inc. – Internally Matched LNA Module

plerow^TM ALN1883T2
Internally Matched LNA Module
Features
· S21 = 22.5 dB @ 1915 MHz
= 23.1dB @ 1850 MHz
· NF of 0.6 dB over Frequency
· Unconditionally Stable
· Single 5V Supply
· High OIP3 @ Low Current
Description
The plerow^TM ALN-series is the compactly designed surface-mount
module for the use of the LNA with or without the following gain blocks in
the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS,
PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communi-
cation terminals, CATV and so on. It has an exceptional performance of
low noise figure, high gain, high OIP3, and low bias current. The stability
factor is always kept more than unity over the application band in order
to ensure its unconditionally stable implementation to the application
system environment. The surface-mount module package including the
completed matching circuit and other components necessary just in case
allows very simple and convenient implementation onto the system
board in mass production level.
Specifications (in Production)
Typ. @ T = 25C, Vs = 5 V, Freq. = 1882.5 MHz, Zo.sys = 50 ohm
Parameter
Specifications
Unit
Min
Typ
Max
Frequency Range
MHz
1850
1915
Gain
Gain Flatness
Noise Figure
Output IP3 ⁽¹⁾
S11 / S22 ⁽²⁾
dB
dB
dB
dBm
dB
21.8
22.8
 0.3
 0.4
0.60
0.65
35
36
-18 / -10
Output P1dB
Switching Time ⁽³⁾
Supply Current
Supply Voltage
Impedance
Max. RF Input Power
Package Type & Size
dBm
sec
mA
V

dBm
mm
20
21
-
100
120
5
50
C.W 29 ~ 31 (before fail)
Surface Mount Type, 10Wx10Lx3.8H
Operating temperature is -40C to +85C.
1) OIP3 is measured with two tones at an output power of 5 dBm / tone separated by 1 MHz.
2) S11/S22 (max) is the worst value within the frequency band.
3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS.
2-stage Single Type
More Information
Website: www.asb.co.kr
E-mail: [e-mail]
Tel: [phone]
Fax: [phone]
Outline Drawing (Unit: mm)
plerow
ALN1883T2
ASB Inc.
(Top View)
Solder Stencil Area
(Bottom View)
Pin Number
2
5
6
Others
Function
RF In
RF Out
Vs
Ground
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
(Side View)
Ø 0.4 plated thru holes to ground plane
1/4
(Recommended Footprint)
www.asb.co.kr
June 2009