96-208M50 Datasheet, PDF (1/1 Pages) Aries Electronics, Inc. – QFP-to-PGA EIAJ 208-Position, 0.0197 [0.50] Pitch Adapter

P/N 96-208M50 QFP-to-PGA EIAJ
208-Position, 0.0197 [0.50] Pitch Adapter
FEATURES
• Convert surface-mount QFP packages to a 17x17 PGA footprint.
• Reduce costs by using less-expensive QFP packages to replace PGA footprints in
existing designs.
• Pins are mechanically fastened and soldered to board using Aries’ patented process,
creating a reliable electrical connection and rugged contact.
• Consult factory for Panelized Form or for mounting of consigned chips.
GENERAL SPECIFICATIONS
• ADAPTER BODY: FR-4 with 1-oz. Cu traces
• PADS: bare Cu protected with Entek^® by Enthone or immersion white Sn to
eliminate coplanarity concerns and solder bridges associated with hot air solder
leveling
• PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
• MALE PIN PLATING: 200µ [5.08µ] Sn/Pb 93/7 per ASTM B579-73 over 100µ
[2.54µ] Ni per SAE AMS-QQ-N-29
• OPERATING TEMPERATURE: 221°F [105°C]
CUSTOMIZATION: In addition to the standard products shown
on this page, Aries specializes in custom design and production.
Special materials, platings, sizes, and configurations can be
furnished, depending on the quantity. NOTE: Aries reserves the
right to change product general specifications without notice.
MOUNTING CONSIDERATIONS
• SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.
• Standard: will plug into PGA sockets
ALL DIMENSIONS: INCHES [MILLIMETERS]
ORDERING INFORMATION
P/N 96-208M50
P/N 96-208M50-P for Panelized Form
P/N 208-PGM17039-30 for Wire Wrap PGA
Socket
ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED
ROW-TO-ROW ±0.003 [±0.08]
PIN-TO-PIN ±0.003 [±0.08] NON-CUMULATIVE
CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS
Bristol, PA 19007-6810 USA
TEL [phone] • FAX [phone]
WWW.ARIESELEC.COM • [e-mail]
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
18031
Rev. AA