95-100I25 Datasheet, PDF (1/1 Pages) Aries Electronics, Inc. – Consult factory for panelized form or for mounting of consigned chips

Part No. 95-100I25 - QFP to PGA Adapter
for JEDEC 100 Position, .025 [.64] Pitch
FEATURES:
• Convert surface mount QFP packages to a 13 x 13 PGA foot-
print.
• Reduce costs by using less expensive QFP packages to replace
PGA footprints in existing designs.
• Pins are mechanically fastened and soldered to board using
Aries’ patented process, creating a reliable electrical connection
and rugged contact.
• Consult factory for panelized form or for mounting of
consigned chips.
SPECIFICATIONS:
• Adapter body is black FR-4 with 1 ounce minimum Copper
traces.
• Pads are bare Copper protected with Entek^® by Enthone or
immersion white tin to eliminate coplanarity concerns and solder
bridges
associated with hot air solder leveling.
• Pins are Brass Alloy 360 1/2 hard per UNS C36000
ASTM-B16-85.
Note: Aries specializes in custom design and production. In addition to the
standard products shown on this page, special materials, platings, sizes, and
configurations can be furnished, depending on quantities. Aries reserves the
right to change product specifications without notice.
• Pin plating is 200µ [5.08µm] min. 93/7 Tin/Lead per MIL-P-
81728 over 100µ [2.54µm] min. Nickel per QQ-N-290.
ORDERING INFORMATION
• Operating temperature=221°F [105°C].
MOUNTING CONSIDERATIONS:
• Suggested PCB hole size=.028 ± .003 [.71 ± .08] dia.
• Will plug into standard PGA sockets.
ALL DIMENSIONS: INCHES [MILLIMETERS]
Tolerances:
Row-to-row: ± .003 [± .08]
Specify Part No. 95-100I25
-or-
95-100I25-P for panelized form
when ordering
Specify Part Number 100-PGM13069-30
for wire wrap PGA socket
Pin-to-pin: ± .003 [± .08] non-cumulative
All others:
± .005 [.13] unless otherwise specified
X-RAY VIEW T0P SIDE
QFP PAD ASSIGNMENT
TOP (PQFP) SIDE
NORTH AMERICA
UK/IRELAND/GB
EUROPE/MAINLAND/HOLLAND
Frenchtown, NJ USA
TEL: [phone] TEL: [phone]
http://www.arieselec.com • [e-mail]
TEL: [phone]
FAX: [phone]
FAX: [phone] FAX: [phone]
[e-mail] [e-mail]
18016
REV.E
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