24013 Datasheet, PDF (1/2 Pages) Aries Electronics, Inc. – High-Frequency Center Probe Test Socket for Devices up to 6.5mm Square

High-Frequency Center Probe Test Socket
for Devices up to 6.5mm Square
FEATURES
• Aries unique universal socketing system allows the socket to be easily configured for any package,
on any pitch (or multiple pitch) from 0.2mm or greater, in any configuration, with little or no tooling
charge or extra lead-time.
• For Test & Burn-In of CSP, µBGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP, SOIC,
LGA, LCC, PLCC, TO and any SMT package style made. Also can be compatible with PGA packaged
devices.
• Quick and easy Probe Replacement System: the complete set of probes can be removed and a new
set (interposer) can be inserted quickly and easily. The old set can be returned to the factory for repair
and sent back within one day.
• The Au over Ni-plated compression Spring-Probes leave very small witness marks on the bottom
surface of the device solder balls.
• Standard molded socket format can accommodate any device package of 6.5mm or smaller, by using machined (for small quantities)
or custom molded (for large quantities) pressure pads and interposers.
• Pressure pad compression spring provides proper force against device and allows for height variations in device thickness.
• 4-point crown insures scrub on solder balls, and raised tip probe provides scrub on pads.
• Signal path during test only 0.077 [1.96].
GENERAL SPECIFICATIONS
ORDERING INFORMATION
• 1dB BANDWIDTH: at 18.5GHz, <3dB to 39.7GHz (0.50mm pitch)
Consult Facotry
• PIN INDUCTANCE: 0.59nH (@ 0.50mm pitch)
• MUTUAL CAPACITANCE: 0.12pF
• VSWR: <2:1 to 38GHz
CLEANING, HANDLING, MOUNTING
& PROBE REPLACEMENT INFO
• CONTACT RESISTANCE: <40 mΩ
• COMPRESSION SPRING PROBES: heat-treated BeCu
• COMPRESSION SPRING PROBE PLATING: 30µ [0.75µ] min. Au per MIL-G-45204 over 30µ [0.75µ]
min. Ni per SAE AMS-QQ-N-290
• ESTIMATED CONTACT LIFE: 500,000 cycles min.
• CONTACT FORCE : 6g per contact on 0.20-0.29mm pitch

: 15g per contact on 0.30-0.35mm pitch
A detailed device drawing must be
sent to Aries to quote and design
a_{__}s_{_}o_{_}c_{_}k_{_}e_{_}t._{___________________}
See Data Sheet for...



: 16g per contact on 0.40-0.45mm pitch
: 25g per contact on 0.50-0.75mm pitch
: 25g per contact on 0.80mm pitch or larger
• OPERATING TEMPERATURE: -55°C [-67°F] min. to 150°C [302°C] max.
• MOLDED SOCKET COMPONENTS: UL 94V-0 Ultem
MOUNTING CONSIDERATIONS
• See “PCB FOOTPRINT TOP VIEW” for requirements
• REQUIRES: two #0-80 screws (supplied) and PEM nuts for mounting (not supplied). Mount-
CSP Sockets
23016 Hybrid Socket
23021 µBGA up to 6.5mm
23017 µBGA up to 13mm
23018 µBGA up to 27mm
23018-APP w/Adj Pressure Pad
23019 µBGA up to 40mm
ing holes size shown may differ depending on PEM nut selected
23020 µBGA up to 55mm
• NOTE: Sockets must be handled with care when mounting or removing sockets to/from PCB _{23023 Optical Failure Analysis}
to avoid damaging spring contacts.
• TEST PCB MINIMUM DIAMETER “G”: 0.025 [0.64] (large probe 0.80mm pitch and larger)
RF Sockets

: 0.015 [0.38] (small probe 0.50-0.75mm pitch)

: 0.012 [0.31] (small probe 0.40-0.45mm pitch)

: 0.009 [0.23] (small probe 0.30-0.35mm pitch)

: 0.004 [0.10] (small probe 0.20-0.20mm pitch)
• TEST PCB DIAMETER SPRING PROBE PAD PLATING: 30µ [0.75µ] min. Au per MIL-G-45204
24008 RF up to 13mm
24009 RF up to 27mm
24009-APP w/Adj Pressure Pad
24011 RF up to 40mm
over 30µ [0.75µ] min. Ni per SEA AMS-QQ-N-290. Pad must be the same height as top
24012 RF up to 55mm
surface of PCB. Please refer to the Custom Socket Drawing supplied by Aries after receipt of _{24010 RF Machined Socket}
your order for your specific application.
23022 Kelvin Test Socket
Bristol, PA 19007-6810 USA
TEL [phone] • FAX [phone]
WWW.ARIESELEC.COM • [e-mail]
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
24013
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Rev. 1.5