24009-APP Datasheet, PDF (1/2 Pages) Aries Electronics, Inc. – High-Frequency Center Probe Test Socket with Adj. Pressure Pad for Devices up to 27mm Sq

High-Frequency Center Probe Test Socket with
Adj. Pressure Pad for Devices up to 27mm Sq
FEATURES
• Aries unique universal socketing system allows the socket to be easily configured for any package,
on any pitch (or multiple pitch) from 0.2mm or greater, in any configuration, with little or no tooling
charge or extra lead-time.
• For Test & Burn-In of CSP, µBGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP,
SOIC, LGA, LCC, PLCC, TO and any SMT package style made. Also can be compatible with PGA
packaged devices.
• Quick and easy Probe Replacement System: the complete set of probes can be removed and a
new set (interposer) can be inserted quickly and easily. The old set can be returned to the factory
for repair and sent back within one day.
• Pressure mounting, no soldering required.
• 4-point crown (other styles also available) insures scrub on solder oxides.
• Signal path during test only 0.077 [1.96].
• Accommodates any package up to 27mm square.
ORDERING INFORMATION
• Small overall socket size/profile allows max. number of sockets per BIB and BIB’s per
Consult Facotry
oven, while being operator-friendly
• Adjustable pressure pad, with a large tolerance, allows for varying device heights as well as ^{CLEANING, HANDLING, MOUNTING}
for fine-tuning pressure pad force to meet specific device requirements.
& PROBE REPLACEMENT INFO
GENERAL SPECIFICATIONS
• MOLDED SOCKET COMPONENTS: UL 94V-0 PEEK and/or Ultem
• PIN INDUCTANCE: 0.51nH (large probe)
• CONTACT RESISTANCE: <40 mΩ
• 1dB BANDWIDTH: to 10.1GHz (0.80mm pitch) (large probe)
• ESTIMATED CONTACT LIFE: 500,000 cycles
• COMPRESSION SPRING PROBES: heat-treated BeCu with 30µ [0.75µ] min. Au per MIL-
G-45204 over 30µ [0.75µ] min. Ni per SAE AMS-QQ-N-290
• CONTACT FORCE : 6g per contact on 0.20-0.29mm pitch

: 15g per contact on 0.30-0.35mm pitch

: 16g per contact on 0.40-0.45mm pitch

: 25g per contact on 0.50-0.75mm pitch

: 25g per contact on 0.80mm pitch or larger
• OPERATING TEMPERATURE: -55°C [-67°F] min. to 150°C [302°F] max.
• ALL HARDWARE: Stainless Steel
MOUNTING CONSIDERATIONS
• SOCKET: mounted with four #4-40 screws (to be removed at time of socket mounted to PCB)
or a tapped, insulated backing plate to be used on underside of PCB for high pin count applications
• NOTE: Sockets must be handled with care when mounting or removing sockets to/from PCB
• TEST PCB MINIMUM DIAMETER “G” : 0.025 [0.64] (large probe 0.80mm pitch and larger)

: 0.015 [0.38] (small probe 0.50-0.75mm pitch)

: 0.012 [0.31] (small probe 0.40-0.45mm pitch)

: 0.009 [0.23] (small probe 0.30-0.35mm pitch)

: 0.004 [0.10] (small probe 0.20-0.20mm pitch)
• TEST PCB DIAMETER SPRING PROBE PAD PLATING: 30µ [0.75µ] min. Au per MIL-G-45204
over 30µ [0.75µ] min. Ni per SEA AMS-QQ-N-290. Pad must be the same height as top surface
of PCB. Please refer to the Custom Socket Drawing supplied by Aries after receipt of your order
for your specific application.
A detailed device drawing must be
sent to Aries to quote and design
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See Data Sheet for...
CSP Sockets
23016 Hybrid Socket
23021 µBGA up to 6.5mm
23017 µBGA up to 13mm
23018 µBGA up to 27mm
23018-APP w/Adj Pressure Pad
23019 µBGA up to 40mm
23020 µBGA up to 55mm
23023 Optical Failure Analysis
RF Sockets
24013 RF up to 6.5mm
24008 RF up to 13mm
24009 RF up to 27mm
24011 RF up to 40mm
24012 RF up to 55mm
24010 RF Machined Socket
23022 Kelvin Test Socket
Bristol, PA 19007-6810 USA
TEL [phone] • FAX [phone]
WWW.ARIESELEC.COM • [e-mail]
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
24009-APP
1 of 2
Rev. 1.5