23026HT Datasheet, PDF (1/1 Pages) Aries Electronics, Inc. – High-Temp 200°C Test & Burn-In Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices

High-Temp 200°C Test & Burn-In Sockets for
BGA, LGA, QFN, MLCC, and Bumped Die Devices
KEY PERFORMANCE ELEMENTS – Series AR4HT
• Aries unique universal socketing system allows the socket to be easily configured
for any package, on any pitch (or multiple pitch) from 0.2mm or greater, in any
configuration, with little or no tooling charge or extra lead-time.
• For Test & Burn-In of CSP, µBGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP,
TSSOP, TSOP, SOP, SOIC, LGA, LCC, PLCC, TO and any SMT package style made.
Also can be compatible with PGA packaged devices.
• Quick and Easy Interposer Replacement System: the complete interposer can be
removed and a new one (interposer) and be inserted quickly and easily. This
saves time and money in your test setup.
• High-Temperature 200°C (high-frequency bandwidth, low inductance, and high-
current applications in a reliable and durable socket housing).
• Excellent Compliance (shorter than other low-profile contacts, enables reliable
ATE testing and burn-in). Excellent choice for low-cost hand test applications.
SILMAT^® CONTACT TECHNOLOGY
ORDERING INFORMATION
• It is NOT a cheap conductive rubber sheet
• It is NOT a prototype or a copy
• It IS a cost-effective, low profile contact structure engineered with specific
materials and features to provide electrical and mechanical advantages for high
performance applications
• It IS an innovative, protected, validated and released product with capacity and
quality control available to meet existing and emerging customer needs
This material can be ordered with
ANY Aries CSP/BGA Sockets
MECHANICAL
• CONTACT LENGTH (compressed): 0.45mm
• PITCH: Released to <0.4mm – Mixed Pitch Available
• PACKAGES: BGA, LGA, QFN, DFN, CSP, POP – Full and Partial Arrays Available
• STRUCTURE: Silmat^® Interposer with Patented Core
• INTERPOSER MATERIALS: Ag Particles in Silicone Elastomer with Polyimide
Core (patented)
• COMPLIANCE RANGE/TRAVEL: Up to 0.23mm
• CONTACT FORCE/LEAD (initial): 20-30 grams/lead
• OPERATING TEMPERATURE: −55°C to 200°C
• LIFE EXPECTANCY: Silmat^® Interposer >10,000 actuations
(influenced by introduction of bias to the IC and the plating
of IC leads will impact the degradation of the contact perfor-
mance)
INTERPOSER
ELECTRICAL (0.5mm pitch)
• BANDWIDTH (frequency response): -1dB at >40GHz
• SELF-INDUCTANCE: 0.10nH
• MUTUAL INDUCTANCE: 0.02nH
• CAPACITANCE TO GROUND: 0.14pF
• MUTUAL CAPACITANCE: 0.01pF
• CONTACT RESISTANCE (initial): <25mΩ
• CURRENT RATING: 4 amps at 14°C heat rise
Cross Section
Elastomer Matrix Compliant Buttons
Column Array
Ag Particles
ALL DIMENSIONS: INCHES [MILLIMETERS]
ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED
FOR TEST SOCKET RECEPTACLES, SEE DATA SHEET 10003
DO NOT USE THIS SOCKET IN A BURN-IN OVEN WITH CONTACTS IN OPEN
POSITION, AS IT WILL DAMAGE THE SOCKET
CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS
CUSTOMIZATION: ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION.
SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATIONS CAN BE
FURNISHED, DEPENDING ON QUANTITY.
ARIES RESERVES THE RIGHT TO CHANGE PRODUCT GENERAL SPECIFICATIONS
WITHOUT NOTICE
PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE
CONSIDERED UNCONTROLLED
2609 Bartram Road • Bristol, PA 19007-6810 USA
TEL [phone] • FAX [phone]
WWW.ARIESELEC.COM • [e-mail]
23026HT
Rev. 1.6
1 of 1