23026 Datasheet, PDF (1/1 Pages) Aries Electronics, Inc. – Hi-Temp 200°C Test & Burn- In Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices

Hi-Temp 200°C Test & Burn- In Sockets for
BGA, LGA, QFN, MLCC, and Bumped Die Devices
KEY PERFORMANCE ELEMENTS – Series AR4HT
• Aries unique universal socketing system allows the socket to be easily config-
ured for any package, on any pitch (or multiple pitch) from 0.2mm or greater, in
any configuration, with little or no tooling charge or extra lead-time.
• For Test & Burn-In of CSP, µBGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP,
TSSOP, TSOP, SOP, SOIC, LGA, LCC, PLCC, TO and any SMT package style
made. Also can be compatible with PGA packaged devices.
• Quick and easy Probe Replacement System: the complete set of probes can be
removed and a new set (interposer) can be inserted quickly and easily. The old
set can be returned to the factory for repair and sent back within one day.
• High-Temperature 200°C (high-frequency bandwidth, low inductance, high-
current, reliable, durable).
• Excellent Compliance (shorter than other low-profile contacts) enables reliable
ATE testing and burn-in. Excellent choice for low-cost hand test applications.
SILMAT^® CONTACT TECHNOLOGY
• It is NOT a cheap conductive rubber sheet.
• It is NOT a prototype or a copy.
• It IS a cost effective, low profile contact structure engineered with specific
materials and features to provide electrical and mechanical advantages for high
performance applications.
• It IS an innovative, protected, validated and released product with capacity and
quality control available to meet existing and emerging customer needs.
ORDERING INFORMATION
This material can be ordered with
ANY Aries CSP Sockets
MECHANICAL
• CONTACT LENGTH (compressed): 0.45mm
• PITCH: Released to <0.4mm – Mixed Pitch Available
• PACKAGES: BGA, LGA, QFN, DFN, CSP, POP – Full and Partial Arrays Available
• STRUCTURE: Silmat^® Interposer with Patented Core
• INTERPOSER MATERIALS: Ag Particles in Silicone Elastomer with Polyimide
Core (patented)
• COMPLIANCE RANGE/TRAVEL: Up to 0.23mm
• CONTACT FORCE/LEAD (initial): 20-30 grams/lead
• OPERATING TEMPERATURE: −55°C to 200°C
• LIFE EXPECTANCY: Silmat^® Interposer >10,000 actuations (influenced by introduction of bias to the IC and the plating of IC leads
will impact the degradation of the contact performance)
FULL-ARRAY SHOWN AS AN EXAMPLE; YOUR SPECIFIC DEVICE
ELECTRICAL (0.5mm pitch)
PATTERN/FOOTPRINT WILL BE SUPPLIED WHEN ORDERED.
• BANDWIDTH (frequency response): -1dB at >40GHz
• SELF-INDUCTANCE: 0.10nH
• MUTUAL INDUCTANCE: 0.02nH
• CAPACITANCE TO GROUND: 0.14pF
• MUTUAL CAPACITANCE: 0.01pF
• CONTACT RESISTANCE (initial): <25mΩ
• CURRENT RATING: 4 amps at 14°C heat rise
INTERPOSER
Column Array
Elastomer Matrix Compliant Buttons
Cross Section
Ag Particles
Bristol, PA 19007-6810 USA
TEL [phone] • FAX [phone]
WWW.ARIESELEC.COM • [e-mail]
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
23026
Rev. 1.7
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