23023 Datasheet, PDF (1/3 Pages) Aries Electronics, Inc. – CSP Test Socket for Optical Laser Failure Analysis w/Emission Microscopy

CSP Test Socket for Optical Laser Failure Analysis
w/Emission Microscopy*
Available with or without filters for UV, infrared and full spectrum applications, this optical test
socket is ideal for testing an optical sensor type chip and for EMMI testing a standard chip using
an infrared head sensor. The optical test socket line can accommodate many different optical window
and lens materials, including glass, sapphire, and plastic depending on operational require-
ments. The standard optical grade window on the 23023 socket uses a high-quality quartz V077
glass with a 98% transmission rate from <260nm in the UV to >2000nm in the infrared.
FEATURES
• Aries unique universal socketing system allows the socket to be easily configured for
any package, on any pitch (or multiple pitch) from 0.2mm or greater, in any configura-
tion, with little or no tooling charge or extra lead-time.
• For Test & Burn-In of CSP, µBGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSSOP,
TSOP, SOP, SOIC, LGA, LCC, PLCC, TO and any SMT package style made. Also can be
compatible with PGA packaged devices.
• Quick and easy Probe Replacement System: the complete set of probes can be
removed and a new set (interposer) can be inserted quickly and easily. The old set
can be returned to the factory for repair and sent back within one day.
• Socket lid nests device into socket for a reliable connection.
• ZIF style socket using Aries solderless, Au-plated pressure mount Spring-Probe.
• Special lid designs and/or materials can be quoted.
• Socket easily located, mounted & removed from PCB.
• Signal path during test only 0.077 [1.96].
• Available with Spring-Probes or Kapton Elastomer Interposer.
• 4-point crown insures “scrub” on solder oxides. Consult factory for other available probe styles.
• The Au over Ni-plated compression Spring-Probes leave very small witness marks on the bottom surface
of the device solder balls.
GENERAL SPECIFICATIONS
• BODY MATERIAL: Ultem^® or Torlon^®
• 1dB BANDWIDTH: 1GHz (0.80mm pitch) (large probe)
• ESTIMATED CONTACT LIFE: 500,000 cycles
• COMPRESSION SPRING PROBES: heat-treated BeCu with 30µ [0.75µ] min. Au per MIL-G-45204
over 30µ [0.75µ] min. Ni per SAE AMS-QQ-N-290
EMMI images showing
light emission from failed
devices at several loca-
tions (front side top)
• CONTACT FORCE : 6g per contact on 0.20-0.29mm pitch

: 15g per contact on 0.30-0.35mm pitch
ORDERING INFORMATION


: 16g per contact on 0.40-0.45mm pitch
: 25g per contact on 0.50-0.75mm pitch
Consult Factory

: 25g per contact on 0.80mm pitch or larger
CLEANING, HANDLING, MOUNTING
• SCREWS AND ALIGNMENT PINS: Stainless Steel
& PROBE REPLACEMENT INFO
• INSERTS: Brass per QQ-B-626
• OPERATING TEMPERATURE RANGE: -55ºC to 150ºC [-67º to 302º]
MOUNTING CONSIDERATIONS
• NOTE: Sockets must be handled with care when mounting or removing sockets to/from PCB
• TEST PCB MINIMUM DIAMETER “P” : 0.025 [0.64] (large probe 0.80mm pitch and larger)

: 0.015 [0.38] (small probe 0.50-0.75mm pitch)

: 0.012 [0.31] (small probe 0.40-0.45mm pitch)

: 0.009 [0.23] (small probe 0.30-0.35mm pitch)

: 0.004 [0.10] (small probe 0.20-0.20mm pitch)
• TEST PCB DIAMETER SPRING PROBE PAD & KIP PLATING: 30µ [0.75µ] min. Au per MIL-G-45204 over 30µ [0.75µ] min. Ni
per SEA AMS-QQ-N-290. Pad must be the same height as top surface of PCB. Please refer to the Custom Socket Drawing
supplied by Aries after receipt of your order for your specific application.
Bristol, PA 19007-6810 USA
TEL [phone] • FAX [phone]
WWW.ARIESELEC.COM • [e-mail]
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
23023
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Rev. 1.5