23022 Datasheet, PDF (1/2 Pages) Aries Electronics, Inc. – Kelvin Test Socket

Kelvin
Test Socket
FEATURES
• LAries unique universal socketing system allows the socket to be easily configured for any package,
on any pitch (or multiple pitch) from 0.2mm or greater, in any configuration, with little or no tooling
charge or extra lead-time.
• For Test & Burn-In of CSP, µBGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP, SOIC,
LGA, LCC, PLCC, TO and any SMT package style made. Also can be compatible with PGA packaged
devices.
• Quick and easy Probe Replacement System: the complete set of probes can be removed and a
new set (interposer) can be inserted quickly and easily. The old set can be returned to the factory for
repair and sent back within one day.
• Low resistance testing using dual independent Aries Kelvin spring-probe technology per device pad
for testing of MLF, QFN, LGA and other leadless devices.
• Socket is easily mounted and removed to & from the test board due to solderless pressure mount compression Spring-Probes which,
are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws.
• The Au over Ni-plated compression Spring-Probes leave very small witness marks on the bottom surface of the device pads.
• Small overall socket size/profile allows max. number of sockets per test board, while
being operator-friendly.
ORDERING INFORMATION
• Kelvin Test Socket Contact System is available for any Aries CSP and Center Probe
Consult Facotry
Test Sockets.
• Pressure pad compression spring provides proper force against device and allows for
height variations in device thickness.
For Quotation with
Details of Your Application
• Probe blade edge tip for cutting through solder oxide layers.
CLEANING, HANDLING, MOUNTING
• Signal path during test only 0.082 [2.08].
& PROBE REPLACEMENT INFO
GENERAL SPECIFICATIONS
• MOLDED SOCKET COMPONENTS: UL 94V-0 Ultem
• MACHINED SOCKET COMPONENTS: UL 94V-0 PEEK or Torlon
• ALL HARDWARE: Stainless Steel
• COMPRESSION SPRING PROBE: heat-treated BeCu
• COMPRESSION SPRING PROBE PLATING: 50µ [1.27µ] min. Au per MIL-G-45204 over 50µ
[1.27µ] min. Ni per SAE AMS-QQ-N-290
• DURABILITY: 500,000 cycles min.
• CONTACT FORCE : 16g/contact on 0.40-0.45mm pitch
• OPERATING TEMPERATURE: -55°C [-67°] min. to 150°C [302°] max.
MOUNTING CONSIDERATIONS
• See “PCB FOOTPRINT TOP VIEW” for requirements
• REQUIRES: four #2-56 screws and PEM nuts for mounting (not supplied – mounting holes
size shown may differ depending on PEM nut selected)
• NOTE: Sockets must be handled with care when mounting or removing to/from test board to
avoid damaging sensitive spring contacts
• TEST PCB DIAMETER “G” : 0.012 [0.31] (small probe 0.40-0.45mm pitch)
• TEST PCB DIAMETER SPRING PROBE PAD PLATING: 30µ [0.75µ] min. Au per MIL-G-45204
over 30µ [0.75µ] min. Ni per SEA AMS-QQ-N-290. Pad must be the same height as top
surface of PCB. Please refer to the Custom Socket Drawing supplied by Aries after receipt of
your order for your specific application.
A detailed device drawing must be
sent to Aries to quote and design
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See Data Sheet for...
CSP Sockets
23016 Hybrid Socket
23021 µBGA up to 6.5mm
23017 µBGA up to 13mm
23018 µBGA up to 27mm
23018-APP w/Adj Pressure Pad
23019 µBGA up to 40mm
23020 µBGA up to 55mm
23023 Optical Failure Analysis
RF Sockets
24013 RF up to 6.5mm
24008 RF up to 13mm
24009 RF up to 27mm
24009-APP w/Adj Pressure Pad
24011 RF up to 40mm
24012 RF up to 55mm
24010 RF Machined Socket
Bristol, PA 19007-6810 USA
TEL [phone] • FAX [phone]
WWW.ARIESELEC.COM • [e-mail]
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
23022
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Rev. 1.8