23016 Datasheet, PDF (1/2 Pages) Aries Electronics, Inc. – CSP/Hybrid Socket

CSP/Hybrid Socket
FEATURES
• Aries unique universal socketing system allows the socket to be easily configured for
any package, on any pitch (or multiple pitch) from 0.2mm or greater, in any configu-
ration, with little or no tooling charge or extra lead-time.
• For Test & Burn-In of CSP, µBGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSSOP,
TSOP, SOP, SOIC, LGA, LCC, PLCC, TO and any SMT package style made. Also can
be compatible with PGA packaged devices.
• Quick and easy Probe Replacement System: the complete set of probes can be
removed and a new set (interposer) can be inserted quickly and easily. The old set
can be returned to the factory for repair and sent back within one day.
• Socket lid nests device into socket for a reliable connection.
• ZIF style socket using Aries solderless, Au-plated pressure mount Spring-Probe.
• Special lid designs and/or materials can be quoted.
• Socket easily located, mounted & removed from PCB.
• Signal path during test only 0.077 [1.96].
• 4-point crown insures scrub on solder oxides – consult factory for other available
probe styles.
• The Au over Ni-plated compression Spring-Probes leave very small witness marks
on the bottom surface of the device solder balls.
ORDERING INFORMATION
Consult Factory for P/N
CLEANING, HANDLING, MOUNTING
& PROBE REPLACEMENT INFO
GENERAL SPECIFICATIONS
• BODY MATERIAL: PEEK or TORLON
• 1dB BANDWIDTH: 1GHz (0.80mm pitch) (large probe)
• ESTIMATED CONTACT LIFE: 500,000 cycles
• COMPRESSION SPRING PROBES: heat-treated BeCu with 30µ [0.75µ] min. Au per MIL-
G-45204 over 30µ [0.75µ] min. Ni per SAE AMS-QQ-N-290
• CONTACT FORCE : 6g per contact on 0.20-0.29mm pitch

: 15g per contact on 0.30-0.35mm pitch

: 16g per contact on 0.40-0.45mm pitch

: 25g per contact on 0.50-0.75mm pitch

: 25g per contact on 0.80mm pitch or larger
• OPERATING TEMPERATURE: -55°C [-67°] min. to 150°C [302°] max.
• SCREWS AND ALIGNMENT PINS: Stainless Steel
• INSERTS: Brass per QQ-B-626, Sn-plated
• OPERATING TEMPERATURE RANGE: -55ºC to 150ºC [-67º to 302º]
MOUNTING CONSIDERATIONS
• NOTE: Sockets must be handled with care when mounting or removing sockets to/from PCB
• TEST PCB MINIMUM DIAMETER “G” : 0.025 [0.64] (large probe 0.80mm pitch and larger)

: 0.015 [0.38] (small probe 0.50-0.75mm pitch)

: 0.012 [0.31] (small probe 0.40-0.45mm pitch)

: 0.009 [0.23] (small probe 0.30-0.35mm pitch)

: 0.004 [0.10] (small probe 0.20-0.20mm pitch)
• TEST PCB DIAMETER SPRING PROBE PAD PLATING: 30µ [0.75µ] min. Au per MIL-G-45204
over 30µ [0.75µ] min. Ni per SEA AMS-QQ-N-290. Pad must be the same height as top
surface of PCB. Please refer to the Custom Socket Drawing supplied by Aries after receipt of
your order for your specific application.
A detailed device drawing must be
sent to Aries to quote and design
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See Data Sheet for...
CSP Sockets
23021 µBGA up to 6.5mm
23017 µBGA up to 13mm
23018 µBGA up to 27mm
23018-APP w/Adj Pressure Pad
23019 µBGA up to 40mm
23020 µBGA up to 55mm
23023 Optical Failure Analysis
RF Sockets
24013 RF up to 6.5mm
24008 RF up to 13mm
24009 RF up to 27mm
24009-APP w/Adj Pressure Pad
24011 RF up to 40mm
24012 RF up to 55mm
24010 RF Machined Socket
23022 Kelvin Test Socket
Bristol, PA 19007-6810 USA
TEL [phone] • FAX [phone]
WWW.ARIESELEC.COM • [e-mail]
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
23016
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Rev. 1.5