18106 Datasheet, PDF (1/1 Pages) Aries Electronics, Inc. – BGA Switch-A-Pitch Adapters

BGA
Switch-A-Pitch Adapters
FEATURES
• Reduce HDI construction by adapting smaller pitch devices to larger footprints
• Convert 0.4mm and 0.5mm pitch footprints to 1mm or 1.27mm pitch (Please con-
tact factory for other pitch requirements)
• Enable the use of standard line and trace spacing
• Eliminate the need for laster-drilled microvias motherboards
GENERAL SPECIFICATIONS
• BOARD MATERIAL: 0.062 thick FR-4 or Rogers 370 HR, with 1/2-oz. Cu traces,
both sides
• PADS: finished with ENIG (Electroless Ni Immersion Au), NSMD
• SOLDER SPHERES: 63/37 Sn/Pb or Pb-free SAC 305
• TRACE WIDTH/SPACE: 0.003 [0.762]
• OPERATING TEMPERATURE: 221°F [105°C] FR-4, 266°F [130°C] Pb-free
MOUNTING CONSIDERATIONS
• SUGGESTED PCB PAD SIZE: 0.022 [0.55] for 1.27mm pitch; 0.020 [0.50] for
1.00mm pitch
ALL DIMENSIONS: INCHES [MILLIMETERS]
ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED
CUSTOMIZATION: In addition to the standard products shown
on this page, Aries specializes in custom design and production.
Special materials, platings, sizes, and configurations can be
furnished, depending on the quantity. NOTE: Aries reserves the
right to change product general specifications without notice.
ORDERING INFORMATION
To obtain a quote for a specific adapter,
please email a request to
[e-mail]
with the following information:
• Your name, company name, and telephone
number
• A drawing or data sheet of the device to
be placed on adapter (top image)
• A drawing or data sheet of the target
footprint for the adapter (bottom image)
• A list of any other design parameters or
restrictions that must be considered
• The quantity of adapters to be quoted
Bristol, PA 19007-6810 USA
TEL [phone] • FAX [phone]
WWW.ARIESELEC.COM • [e-mail]
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
18106
Rev. AB