1110748 Datasheet, PDF (1/1 Pages) Aries Electronics, Inc. – Surface Mount-to-DIP JEDEC SOT-25, SOT-23A-6 Adapter

P/N 1110748 Surface Mount-to-DIP JEDEC
SOT-25, SOT-23A-6 Adapter
FEATURES
• Allows for breadboarding or substitution of Microgate SOT-23A-6 and SOT-25 IC
and transistor packages into 0.100 [2.54] pitch proto boards or PC boards.
• Solder masked top-side pads allow user to hand solder devices directly to topside of
adapter with fewer problems of solder bridging.
• Longer male bottom Pins available at special request for easy use of probe clips.
• Large topside pads allow for soldering test pins, jumpers, etc. to top of adapter.
GENERAL SPECIFICATIONS
• BOARD MATERIAL: 0.062 [1.58] thick FR-4 manufactured to IPC-600E, Class 2
standards, with 1-oz. Cu traces, both sides
• PADS: HASL
• PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
• PIN PLATING: 200µ [5.08µ] Sn/Pb 93/7 ASTM B579-73 over 100µ [2.54µ] Ni
per SAE-AMS-QQ-N-290
• OPERATING TEMPERATURE: 221°F [105°C]
MOUNTING CONSIDERATIONS
• SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.
ALL DIMENSIONS: INCHES [MILLIMETERS]
CUSTOMIZATION: In addition to the standard products shown
on this page, Aries specializes in custom design and production.
Special materials, platings, sizes, and configurations can be
furnished, depending on the quantity. NOTE: Aries reserves the
right to change product general specifications without notice.
ORDERING INFORMATION
P/N 1110748
P/N 1110748-P for Panelized Version
ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED
ALL CAC’s ARE MANUFACTURED ND INSPECTED USING IPC -610B
CLASS 2 GUIDELINES
CONSULT FACTORY FOR MOUNTING CONSIDERATIONS OF
CONSIGNED CHIPS.
CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS
Bristol, PA 19007-6810 USA
TEL [phone] • FAX [phone]
WWW.ARIESELEC.COM • [e-mail]
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
18043
Rev. AA