APR9301-V2-1 Datasheet, PDF (6/7 Pages) Aplus Intergrated Circuits – SINGLE-CHIP VOICE RECORDING & PLAYBACK DEVICE FOR SINGLE 20 TO 30 SECOND MESSAGE

APLUS
APR9301-V2
Bonding Pad Diagram & Description of Bonding Pad Coordinates
Figure 5 APR9301-V2 Die Bonding Pad Diagram
/CE
NC
NC
NC
OscR
NC NC _NC
V
V
CCD
CCD
/RecL
NU2
/LED
NC
/PlayE
NC
NC
NC
NU1
V ^SSD
V ^SSA
V ^SSA
SP+
NC
APR9301-V2
SP-
V
CCA
V
CCA
AnaOut
AnaIn
MicIn ^MicRef AGC
Table 5 APR9301-V2 Bonding Pad Coordinates
Pin
Pin Name
/CE
OscR
NU1
V_SSD
V_SSA
V_SSA
SP+
SP-
V_CCA
V_CCA
MicIn
Chip Enable
Oscillator Frequency-Setting Resistor
Connect to Ground
Digital Ground Supply
Analog Ground Supply
Analog Ground Supply
Non-Inverting Speaker Output
Inverting Speaker Output
Analog Power Supply
Analog Power Supply
Microphone Input
MicRef
Microphone Reference Input
AGC
Automatic Gain Control
AnaIn
Analog Signal Input
AnaOut
Analog Signal Output
/PlayE
Edge-Activated Playback
/LED
LED Output
NU2
Connect to Ground
/RecL
Level-Activated Record
V_CCD
Digital Power Supply
V_CCD
Digital Power Supply
Note: With respect to die center (µm)
X Axis^(Note)
-2496.20
-2459.55
-1808.45
-1564.05
-1384.05
-1204.35
-707.15
479.15
976.45
1190.40
1619.45
2035.45
2487.45
2487.45
2487.45
2493.65
1430.70
865.75
258.15
-229.40
-510.80
Notes:
Die diagram is with respect to die
center (µm).
Die Dimensions:
x = 214 + 1 mils
y = 144 + 1 mils
Die Thickness:
13.8 + 1.0 mils
(350 + 25 µm
Pad Opening:
110 µ m
4.3 mils
Connect substrate to ground.
Y Axis^(Note)
1565.80
729.80
-1496.10
-1572.00
-1548.70
-1477.10
-1390.00
-1389.90
-1492.00
-1523.70
-1551.40
-1551.40
-1551.40
-1049.90
-648.90
1371.10
1565.80
1565.80
1565.80
1579.05
1541.60
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