AP89021_15 Datasheet, PDF (18/18 Pages) Aplus Intergrated Circuits – APLUS INTEGRATED CIRCUITS INC

Integrated Circuits Inc.
6. Bonding Diagram (aP89021)
aP89021/010
Bonding Diagram (aP89010)
Note: Substrate should be connected to Vss.
Bonding pad size: 80um x 90um
Ver 4.0
18
Aug 23, 2010