3090R Datasheet, PDF (1/1 Pages) API Delevan – Micro i® Low Profile Chip Inductors

SERIES
3090R
3090
Micro i^® Low Profile Chip Inductors
DASH _{NUMBEIRN*DUCTANCE (µH)TOLERANCE}
QTEMSINTIMFRUEMQUENCY
RF
S(MRHFzM) _{INIMUMM(MAHXzIM) DUCMR(OESHIMSSTA)MNACCXUEIRMRUEMN(TmRAA)TING}
Inductors
Actual Size
Physical Parameters
Inches
A 0.050 Max.
B 0.100±0.010
C 0.100±0.010
D 0.050 Min.
E 0.015 Min. (Typ.)
F 0.020 Max. (Typ.)
Millimeters
1.27 Max.
2.54±0.254
2.54±0.254
1.27 Min.
0.38 Min. (Typ.)
0.51 Max. (Typ.)
Current Rating at 90°C Ambient 35°C Rise
Operating Temperature Range –55°C to +125°C
Maximum Power Dissipation at 90°C 0.105 W
Core Material Powdered iron core for improved
temperature stability.
SERIES 3090 IRON CORE
-100M 0.010 ± 20% 42
50.0 1000 0.095 890
-150M 0.015 ± 20% 42
50.0 1000 0.115 810
-220M 0.022 ± 20% 40
50.0 1000 0.140 765
-330K 0.033 ± 10% 40
50.0
900 0.185 640
-390K 0.039 ± 10% 40
50.0
900 0.100 870
-470K 0.047 ± 10% 38
50.0
900 0.110 830
-560K 0.056 ± 10% 35
50.0
800 0.135 750
-680K 0.068 ± 10% 30
50.0
700 0.16
690
-820K 0.082 ± 10% 25
50.0
650 0.19
630
-101K 0.10 ± 10% 32
25.0
510 0.08
970
-121K 0.12 ± 10% 32
25.0
410 0.10
870
-151K 0.15 ± 10% 32
25.0
370 0.12
795
-181K 0.18 ± 10% 32
25.0
330 0.14
765
-221K 0.22 ± 10% 34
25.0
300 0.16
690
-271K 0.27 ± 10% 34
25.0
250 0.20
615
-331K 0.33 ± 10% 34
25.0
220 0.25
550
-391K 0.39 ± 10% 34
25.0
200 0.30
500
-471K 0.47 ± 10% 34
25.0
180 0.36
460
-561K 0.56 ± 10% 34
25.0
160 0.45
410
-681K 0.68 ± 10% 30
25.0
140 0.50
390
-821K 0.82 ± 10% 28
25.0
120 0.60
355
-102K 1.00 ± 10% 24
25.0
100 0.70
330
-122K 1.20 ± 10% 24
7.9
95 1.10
265
-152K 1.50 ± 10% 24
7.9
90 1.20
250
-182K 1.80 ± 10% 24
7.9
85 1.25
245
-222K 2.20 ± 10% 25
7.9
80 1.30
240
-272K 2.70 ± 10% 25
7.9
70 1.50
225
-332K 3.30 ± 10% 25
7.9
65 1.90
200
-392K 3.90 ± 10% 25
7.9
60 2.30
180
-472K 4.70 ± 10% 24
7.9
55 3.00
160
-562K 5.60 ± 10% 22
7.9
53 3.50
145
-682K 6.80 ± 10% 22
7.9
50 4.00
135
-822K 8.20 ± 10% 22
7.9
45 4.50
130
-103K 10.0 ± 10% 20
7.9
40 5.00
120
Mechanical Configuration Units are epoxy
encapsulated. Contact area for reflow soldering are gold
plated per MIL-G-45204 Type 1 Grade A. Internal
connections are thermal compression bonded.
Termination Finish Options
Standard: Gold over Nickel.
For Tin/Lead over Nickel: Add suffix “S” to part number and
allow an additional .010 inch for maximum height. For
RoHS, order 3090R - XXXKS.
Optional Tolerances: J = 5% H = 3% G = 2% F = 1%
*Complete part # must include series # PLUS the dash #
For surface finish information, refer to www.delevanfinishes.com
Notes 1) Designed specifically for reflow soldering and
other high temperature processes with metalized edges to
exhibit solder fillet. 2) Self Resonant Frequency (SRF)
values 250 MHz and above are calculated and for
reference only.
Packaging Tape & reel (8mm): 7" reel, 2000 pieces max.;
13" reel, 8000 pieces max.
MIL-PRF-83446 (Reference) for testing methods only.
Made in the U.S.A.
270 Quaker Rd., East Aurora NY 14052 • Phone [phone] • Fax [phone] • E-mail: [e-mail] • www.delevan.com
1/2009