TO252 Datasheet, PDF (1/1 Pages) Global Mixed-mode Technology Inc – Package Outline

ALPHA & OMEGA
SEMICONDUCTOR, LTD.
S
Y
M
B
O
L
A
A1
A2
b
RECOMMENDED LAND PATTERN
b1
b2
c
6.25 MIN.
c1
D
D1
6.80 MIN.
D2
E
6.60
E1
1.50 MIN.
E2
3.00 MIN.
e
e1
2.286
H
4.572 BSC
UNIT: mm
L
L1
NOTE
L2
1. PACKAGE BODY SIZES EXCLUDE MOLD FLASH AND
L3
GATE BURRS. MOLD FLASH SHOULD BE LESS THAN
L4
6 MILS.
2. DIMENSION L IS MEASURED IN GAUGE PLANE
3. TOLERANCE 0.10 mm UNLESS OTHERWISE SPECIFIED
4. CONTROLLING DIMENSION IS MILLIMETER. CONVERTED
INCH DIMENSIONS ARE NOT NECESSARILY EXACT.
5. REFER TO JEDEC TO-252 (AA)
DIMENSION IN MILLIMETERS
MIN.
2.184
0.000
0.889
0.635
0.762
4.953
0.450
0.450
5.969
5.210
0.662
6.350
4.318
1.678
9.398
1.270
0.408
0.889
0.635
NOM.
MAX.
2.286
2.388
-----
0.127
1.041
1.143
0.762
0.889
0.840
1.143
5.340
5.461
0.508
0.610
0.508
0.610
6.096
6.223
5.249
5.380
0.762
0.862
6.604
6.731
4.826
4.901
1.778
1.878
2.286 BSC
4.572 BSC
10.033
10.414
1.520
2.032
2.921 REF.
0.508
0.608
1.016
1.270
-----
1.016
DIMENSIONS IN INCHES
MIN.
0.086
0.000
0.035
0.025
0.030
0.195
0.018
0.018
0.235
0.205
0.026
0.250
0.170
0.066
0.370
0.050
0.016
0.035
0.025
NOM.
0.090
-----
0.041
0.030
0.033
0.210
0.020
0.020
0.240
0.207
0.030
0.260
0.190
0.070
0.090 BSC
0.180 BSC
0.395
0.060
0.115REF.
0.020
0.040
-----
MAX.
0.094
0.005
0.045
0.035
0.045
0.215
0.024
0.024
0.245
0.212
0.034
0.265
0.193
0.074
0.410
0.080
0.024
0.050
0.040