APX9031 Datasheet, PDF (8/10 Pages) Anpec Electronics Coropration – Hall Effect Sensor IC

APX9031
Physical Specifications
Terminal Material
Lead Solderability
Packaging
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb)
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
1000 devices per reel
Reflow Condition (IR/Convection or VPR Reflow)
Reference JEDEC Standard J-STD-020A APRIL 1999
Pre-heat temperature
183^°C
Peak temperature
Time
Classification Reflow Profiles
Average ramp-up rate(183°C to Peak)
Preheat temperature 125 ± 25°C)
Temperature maintained above 183°C
Time within 5°C of actual peak temperature
Peak temperature range
Ramp-down rate
Time 25°C to peak temperature
Convection or IR/
Convection
3°C/second max.
120 seconds max
60 – 150 seconds
10 –20 seconds
220 +5/-0°C or 235 +5/-0°C
6 °C /second max.
6 minutes max.
VPR
10 °C /second max.
60 seconds
215-219°C or 235 +5/-0°C
10 °C /second max.
Package Reflow Conditions
pkg. thickness ≥ 2.5mm
and all bgas
Convection 220 +5/-0 °C
VPR 215-219 °C
IR/Convection 220 +5/-0 °C
pkg. thickness < 2.5mm and
pkg. volume ≥ 350 mm³
pkg. thickness < 2.5mm and pkg.
volume < 350mm³
Convection 235 +5/-0 °C
VPR 235 +5/-0 °C
IR/Convection 235 +5/-0 °C
Copyright  ANPEC Electronics Corp.
8
Rev. A.3 - Apr., 2001
www.anpec.com.tw