APL3225 Datasheet, PDF (2/15 Pages) Anpec Electronics Coropration – Li+ Charger Protection IC

APL3225
Ordering and Marking Information
APL3225
Assembly Material
Handling Code
Temperature Range
Package Code
Package Code
QB : TDFN2x2-8 QA : DFN3x3-8
Operating Ambient Temperature Range
I : -40 to 85 ^oC
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
L25
APL3225 QB:
X
X - Date Code
APL3225 QA:
APL
3225
XXXXX
X - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Absolute Maximum Ratings ^{(Note 1)}
Symbol
Parameter
Rating
Unit
VACIN
VCHR_LDO
VGATDRV
VCDT
VOUT
IOUT
TJ
TSTG
TSDR
ACIN Input Voltage (ACIN to GND)
CHR_LDO to GND Voltage
GATDRV to GND Voltage
VCDT to GND Voltage
OUT to GND Voltage
Output Current (OUT to GND)
Maximum Junction Temperature
Storage Temperature
Maximum Lead Soldering Temperature (10 Seconds)
-0.3 ~ 28
V
-0.3 ~ 7
V
-0.3 ~ VCHR_LDO
V
-0.3 ~ 7
V
-0.3 ~ 7
V
2
A
150
o_C
-65 ~ 150
o_C
260
o_C
Note 1:Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under ”recom-
mended operating conditions”is not implied. Exposure to absolute maximum rating conditions for extended periods may affect vice
reliability.
Thermal Characteristic
Symbol
Parameter
Typical Value
Unit
θJA
TDFN2x2-8 Junction-to-Ambient Resistance in free air ^{(Note 2)}
θJA
DFN3x3-8 Junction-to-Ambient Resistance in free air ^{(Note 2)}
75
o_C/W
65
o_C/W
Note 2: θ_JA is measured with the component mounted on a high effective thermal conductivity test board in free air. The exposed
pad of TDFN2x2-8 is soldered directly on the PCB.
Copyright © ANPEC Electronics Corp.
2
Rev. A.1 - Nov., 2012
www.anpec.com.tw