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APL5930 Datasheet, PDF (12/17 Pages) Anpec Electronics Coropration – 3A, Ultra Low Dropout (0.23V Typical) Linear Regulator
APL5930
Layout Consideration
1. Please solder the Exposed Pad on the VIN pad on
the top-layer of PCBs. The VIN pad must have wide
size to conduct heat into the ambient air through the
VIN plane and PCB as a heat sink.
2. Please place the input capacitors for VIN and VCNTL
pins near the pins as close as possible for
decoupling high-frequency ripples.
3. Ceramic decoupling capacitors for load must be
placed near the load as close as possible for
decoupling high-frequency ripples.
4. To place APL5930 and output capacitors near the
load reduces parasitic resistance and inductance
for excellent load transient response.
5. The negative pins of the input and output capacitors
and the GND pin must be connected to the ground
plane of the load.
6. Large current paths, shown by bold lines on the fig-
ure 1, must have wide tracks.
7. Place the R1, R2, and C1 near the APL5930 as close
as possible to avoid noise coupling.
8. Connect the ground of the R2 to the GND pin by us-
ing a dedicated track.
9. Connect the one pin of the R1 to the load for Kelvin
sensing.
10. Connect one pin of the C1 to the VOUT pin for reli-
able feedback compensation.
Thermal Consideration
Refer to the figure 2, the SOP-8P is a cost-effective pack-
age featuring a small size like a standard SOP-8 and a
bottom exposed pad to minimize the thermal resistance
of the package, being applicable to high current applica-
tions. The exposed pad must be soldered to the top-layer
VIN plane. The copper of the VIN plane on the Top layer
conducts heat into the PCB and ambient air. Please en-
large the area of the top-layer pad and the VIN plane to
reduce the case-to-ambient resistance (θCA).
102 mil
118 mil
1
8
2
7
SOP-8P
3
6
4
5
Ambient
Air
Top
VOUT
plane
Exposed
Die Pad
Top
VIN
plane
PCB
Figure 2
CCNTL
VCNTL
VCNTL
VIN
APL5930
VOUT
C1
FB
GND
R2
CIN
COUT
R1
VIN
VOUT
Load
Recommended Minimum Footprint
0.024
8765
0.138
Figure 1
12
0.050
34
Unit : Inch
Copyright © ANPEC Electronics Corp.
12
Rev. A.4 - Sep., 2009
www.anpec.com.tw