B0008K7575A00 Datasheet, PDF (7/7 Pages) Anaren Microwave – Ultra Low Profile 0606 Balun

B0008K7575A00
Rev B
Mounting Configuration:
In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be
used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet
published specifications.
All of the Xinger components are constructed from softboard composites which possess excellent electrical and
mechanical stability having X and Y thermal coefficient of expansion (CTE) of 25 ppm/°C.
An example of the PCB footprint used in the testing of these parts is shown below. In specific designs, the
transmission line widths need to be adjusted to the unique dielectric coefficients and thicknesses as well as varying
pick and place equipment tolerances.
3X TRANSMISSION
LINE
.019 [0.49] _{Top View (Near-side)}
SQ.
2
1
3X TRANSMISSION
LINE
.019 [0.49]
SQ.
Top View (Near-side)
2
1
3X
.016 [0.40]
SQ.
3
4
3X
.016 [0.40]
SQ.
3
4
.043 [1.10]
.043 [1.10]
Circuit Pattern
Footprint Pad (s)
Solder Resist
Dimensions are in Inches [Millimeters]
Mounting Footprint
Circuit Pattern
Footprint Pad (s)
Solder Resist
Dimensions are in Inches [Millimeters]
Mounting Footprint
The material used for testing is 8mil Rogers 4003. For a ground plane spacing much larger than this the
single via at pin 5 should be replaced with at least 2 via and if possible a coplanar ground.
Available on Tape
and Reel for Pick and
Place Manufacturing.
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