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BD2425N50200AHF Datasheet, PDF (4/5 Pages) Anaren Microwave – Ultra Low Profile 0404 Balun 50 to 200 Balanced
Model BD2425N50200AHF
Rev A
Mounting Configuration:
In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be
used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet
published specifications.
All of the Xinger components are constructed from ceramic filled PTFE composites which possess excellent electrical
and mechanical stability having X and Y thermal coefficient of expansion (CTE) of 17 ppm/oC.
An example of the PCB footprint used in the testing of these parts is shown below. An example of a DC-biased
footprint is also shown below. In specific designs, the transmission line widths need to be adjusted to the unique
dielectric coefficients and thicknesses as well as varying pick and place equipment tolerances
With No DC Bias
3X
.011 [0.28]
SQ
3X Transmission
Line
Circuit Pattern
Footprint Pad (s)
Solder Resist
Plated thru
hole to
ground
.014 [0.36]
.008 [0.20]
With DC Bias
3X .011
[0.28]
.008 [0.20]
3X .011
[0.28]
.020 [0.51]
Dimensions are in Inches [Millimeters]
Mounting Footprint
.020
[0.51]
3X Transmission
Line
Circuit Pattern
Footprint Pad (s)
Solder Resist
Plated thru
hole to
ground
.014 [0.36]
.008 [0.20]
.020 [0.51]
Dimensions are in Inches [Millimeters]
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 411-6596
+44 2392-232392
Available on Tape and
Reel for Pick and Place
Manufacturing.