X0060L7575AHF Datasheet, PDF (3/4 Pages) Anaren Microwave – Non-conductive Surface

Mounting Configuration:
Model X0060L7575AHF
Rev B
C
In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be used
to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet published
specifications.
All of the Xinger components are constructed from organic PTFE based composites which possess excellent electrical
and mechanical stability. Xinger components are compliant to a variety of ROHS and Green standards and ready for Pb-
free soldering processes. Pads are Gold plated with a Nickel barrier.
An example of the PCB footprint used in the testing of these parts is shown below. In specific designs, the transmission
line widths need to be adjusted to the unique dielectric coefficients and thicknesses as well as varying pick and place
equipment tolerances.
Circuit Pattern
Footprint Pad (s)
Dimensions are in Millimeters
Mounting Footprint
Solder Resist
3x Transmission
lines
12x
.04
6x .31
12x .04
6x .36
4x .14
Plated thru
holes to
ground
3x .21
PART ORIENTATION
TOP DOWN
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