X0060L5050AHF Datasheet, PDF (3/4 Pages) Anaren Microwave – Ultra Low Profile 0603 RF Crossover

Model X0060L5050AHF
Rev A
Mounting Configuration:
In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be used
to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet published
specifications.
All of the Xinger components are constructed from ceramic filled PTFE composites which possess excellent electrical
and mechanical stability having X and Y thermal coefficient of expansion (CTE) of 17 ppm/^oC.
An example of the PCB footprint used in the testing of these parts is shown on below. In specific designs, the transmission
line widths need to be adjusted to the unique dielectric coefficients and thicknesses as well as varying pick and place
equipment tolerances.
Circuit Pattern
Footprint Pad (s)
Solder Resist
Dimensions are in Millimeters
Mounting Footprint
3x Transmission
lines
12x
.04
6x .31
12x .04
6x .36
4x .14
Plated thru
holes to
ground
3x .21
PART ORIENTATION
TOP DOWN
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