RFP-40-100RPP Datasheet, PDF (2/2 Pages) Anaren Microwave – Flangeless Resistors

Model RFP-40-100RPP
Typical Performance
Power Derating
Suggested Mounting Procedures
100
75
50
25
0
25
50
75
100 125
150
CASE TEMPERATURE — °C
.025 MIN.
(2 PLACES)
BOARD LOWER
THAN LEAD.
BOARD EVEN
WITH LEAD.
SUGGESTED STRESS RELIEF METHODS
SCALE:
BOARD LOWER
THAN LEAD.
BOARD HIGHER
THAN LEAD.
NOT RECOMMENDED APPLICATION
SCALE:
1. Make sure that the devices are mounted on flat surfaces
(.001” under the device) to optimize the heat transfer.
2. Position device on mounting surface and solder in place
using an indalloy type or an SN63 type solder.
3. Solder leads in place using an SN63 type solder with a
controlled temperature iron (210°C).
2
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