RFP-250375-4Z50-2 Datasheet, PDF (2/2 Pages) Anaren Microwave – Surface Mount Terminations

Model RFP-250375-4Z50-2
Typical Performance
Power Derating
Suggested Mounting Procedures
100
75
50
25
0
25
50
75
100 125
P.C.B. SOLDER INTERFACE TEMPERATURE
°C
SOLDER
PASTE
PC BOARD
HEATSINK
SCREW
(2 PLS.)
SOLDER
FILLED VIA
1. Solder part in place using 60/40 type solder with controlled
temperature iron (700°F).
2. Drill thermal vias through PCB and fill with solder, such as
60/40 type.
3. To ensure good thermal connectivity to heat sink, drill and
tap heatsink and mount PCB board to heat sink using
screws.
Available on Tape and Reel for Pick and Place Manufacturing.
2
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