RFP-250375-4X50-2 Datasheet, PDF (2/2 Pages) Anaren Microwave – Chip Terminations 150 Watts, 50ohm

Model RFP-250375-4X50-2
Typical Performance
Power Derating
Suggested Mounting Procedures
100
75
50
25
0
25
50
75 100 125 150
P.C.B. SOLDER INTERFACE TEMPERATURE — °C
.025 MIN.
(2 PLACES)
BOARD LOWER
THAN LEAD.
BOARD EVEN
WITH LEAD.
SUGGESTED STRESS RELIEF METHODS
SCALE:
BOARD LOWER
THAN LEAD.
BOARD HIGHER
THAN LEAD.
NOT RECOMMENDED APPLICATION
SCALE:
1. Make sure that the devices are mounted on flat surfaces
(.001” under the device) to optimize the heat transfer.
2. Position device on mounting surface and solder in place
using an indalloy type or a 60/40 type solder.
3. Solder leads in place using a 60/40 type solder with a
controlled temperature iron (700°F).
Available on Tape and Reel for Pick and Place Manufacturing.
2
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