RFP-20N50TPC Datasheet, PDF (2/2 Pages) Anaren Microwave – Aluminum Nitride Terminations

Model RFP-20N50TPC
Typical Performance
Power Derating
Suggested Mounting Procedures
.025 MIN.
(2 PLACES)
100
75
50
25
0
25
50
75
100 125
CASE TEMPERATURE — °C
BOARD LOWER
THAN LEAD.
BOARD EVEN
WITH LEAD.
SUGGESTED STRESS RELIEF METHODS
SCALE: NONE
BOARD LOWER
THAN LEAD.
BOARD HIGHER
THAN LEAD.
NOT RECOMMENDED APPLICATION
SCALE: NONE
1. Make sure that the devices are mounted on flat surfaces
(.001" under the device) to optimize the heat transfer.
2. Drill & tap the heatsink for the appropriate thread size to be
used.
150 3. Coat heatsink with a minimum amount of high quality
silicone grease (.001" max. thickness).
4. Position device on mounting surface & secure using socket
head screws, flat & split washers. Torque screws to the
appropriate value. Make sure that the device is flat against
the heatsink. (Care should be taken to avoid upward
pressure of the leads towards the lid).
5. Solder leads in place using an SN63 type solder with a
controlled temperature iron (700°F).
2
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