RFP-100200N4X50-2 Datasheet, PDF (2/2 Pages) Anaren Microwave – Aluminum Nitride Terminations

Model RFP-100200N4X50-2
Typical Performance
Power Derating
Suggested Mounting Procedures
.025 MIN.
(2 PLACES)
100
75
50
25
0
25
50
75
100 125
CASE TEMPERATURE — °C
BOARD LOWER
THAN LEAD.
SUGGESTED STRESS RELIEF METHODS
SCALE: NONE
1. Make sure that the devices are mounted on flat surfaces
(.001” under the device) to optimize the heat transfer.
150
2. Position device on mounting surface and solder in place
using an SN96 type solder.
3. Solder leads in place using an SN63 type solder with a
controlled temperature iron (700°F).
Available on Tape and Reel for Pick and Place Manufacturing.
2
Sales Desk USA: Voice: [phone] Fax: [phone]
Sales Desk Europe: Voice: ([phone] Fax: [phone]