G300N50W4 Datasheet, PDF (2/7 Pages) Anaren Microwave – RoHS Compliant

Model G300N50W4
Rev A
Typical Performance with 30mil thick PCB and recommended Z-bend lead:
G300N50W4 Return Loss
Power De-rating:
Mounting and Lead Stress Relief Options:
100
75
50
25
0
25 50 75 100 125 150
Solder Interface Temperature -°C
*Actual performance could be limited by the solder
properties of the application
Board lower
than lead
Board even
with lead
Board lower
than lead
Board higher
than lead
Suggested stress relief methods
Scale: None
Not recommended application
Scale: None
Suggested Mounting Procedures:
1. Make sure that the devices are mounted on flat surfaces to optimize the
heat transfer
2. Position devices on mounting surface and solder in place using appropriate
solder
3. solder leads in place using appropriate solder type with a controlled
temperature iron
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