B0809J50ATI Datasheet, PDF (2/4 Pages) Anaren Microwave – Impedance Matched Ultra Low profile 0805 Balun for TI CC1101/1100 chipset

Model B0809J50ATI
Rev A
Mounting Configuration:
In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be
used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet
published specifications.
All of the Xinger components are constructed from organic PTFE based composites which possess excellent
electrical and mechanical stability. Xinger components are compliant to a variety of ROHS and Green standards and
ready for Pb-free soldering processes. Pads are Gold plated with a Nickel barrier.
An example of the PCB footprint used in the testing of these parts is shown below. In specific designs, the
transmission line widths need to be adjusted to the unique dielectric coefficients and thicknesses as well as varying
pick and place equipment tolerances.
4x .25
6x .41
6x .33
.66
.04
3x Transmission
lines
Circuit Pattern
Footprint Pad (s)
Solder Resist
Dimensions are in Millimeters
Mounting Footprint
2x Plated thru
holes to
ground
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