X3C25F1-02S Datasheet, PDF (14/18 Pages) Anaren Microwave – High Isolation

Model X3C25F1-02S
Rev D
Mounting
Coupler Mounting Process
In order for Xinger surface mount couplers to work
optimally, there must be 50Ω transmission lines leading
to and from all of the RF ports. Also, there must be a
very good ground plane underneath the part to ensure
proper electrical performance. If either of these two
conditions is not satisfied, electrical performance may not
meet published specifications.
The process for assembling this component is a
conventional surface mount process as shown in Figure
1. This process is conducive to both low and high volume
usage.
Overall ground is improved if a dense population of
plated through holes connect the top and bottom ground
layers of the PCB. This minimizes ground inductance
and improves ground continuity. All of the Xinger hybrid
and directional couplers are constructed from ceramic
filled PTFE composites which possess excellent electrical
and mechanical stability having X and Y thermal
coefficient of expansion (CTE) of 17-25 ppm/^oC.
When a surface mount hybrid coupler is mounted to a
printed circuit board, the primary concerns are; ensuring
the RF pads of the device are in contact with the circuit
trace of the PCB and insuring the ground plane of neither
the component nor the PCB is in contact with the RF
signal.
Mounting Footprint
Figure 1: Surface Mounting Process Steps
Storage of Components: The Xinger products are
available in an immersion tin finish. IPC storage
conditions used to control oxidation should be followed
for these surface mount components.
Substrate: Depending upon the particular component,
the circuit material has an x and y coefficient of thermal
expansion of between 17 and 25 ppm/°C. This coefficient
minimizes solder joint stresses due to similar expansion
rates of most commonly used board substrates such as
RF35, RO4003, FR4, polyimide and G-10 materials.
Mounting to “hard” substrates (alumina etc.) is possible
depending upon operational temperature requirements.
The solder surfaces of the coupler are all copper plated
with an immersion tin finish.
To ensure proper electrical and thermal
performance there must be a ground plane with
100% solder connection underneath the part
orientated as shown with text facing up.
X3C
XXFX-XXS
RR CC
Solder Paste: All conventional solder paste formulations
will work well with Anaren’s Xinger surface mount
components. Solder paste can be applied with stencils or
syringe dispensers. An example of a stenciled solder
paste deposit is shown in Figure 2. As shown in the
figure solder paste is applied to the four RF pads and the
entire ground plane underneath the body of the part.
4x .015
[0.38]
4x .065
[1.65]
4x .039
[0.98]
4x 50
Transmission
Line
.140
[3.56]
Multiple Plated
Thru Holes
To Ground
Dimensions are in Inches [Millimeters]
X3CXXFX-XXS Mounting Footprint
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Available on Tape and
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Manufacturing.