X3C07P1-04S Datasheet, PDF (14/19 Pages) Anaren Microwave – Production Friendly

Model X3C07P1-04S
Rev A
Mounting
Coupler Mounting Process
In order for Xinger surface mount couplers to work
optimally, there must be 50Ω transmission lines leading
to and from all of the RF ports. Also, there must be a
very good ground plane underneath the part to ensure
proper electrical performance. If either of these two
conditions is not satisfied, electrical performance may not
meet published specifications.
The process for assembling this component is a
conventional surface mount process as shown in
Figure 1. This process is conducive to both low and
high volume usage.
Overall ground is improved if a dense population of
plated through holes connect the top and bottom ground
layers of the PCB. This minimizes ground inductance
and improves ground continuity. All of the Xinger hybrid
and directional couplers are constructed from ceramic
filled PTFE composites which possess excellent
electrical and mechanical stability having X and Y
thermal coefficient of expansion (CTE) of 17-25 ppm/^oC.
When a surface mount hybrid coupler is mounted to a
printed circuit board, the primary concerns are; ensuring
the RF pads of the device are in contact with the circuit
trace of the PCB and insuring the ground plane of neither
the component nor the PCB is in contact with the RF
signal.
Mounting Footprint
To ensure proper electrical and thermal performance
there must be a ground plane with 100%
solder connection underneath the part orientated as
shown with text facing up.
Figure 1: Surface Mounting Process Steps
Storage of Components: The Xinger III products
are available in either an immersion tin or tin-lead
finish. Commonly used storage procedures used to
control oxidation should be followed for these
surface mount components. The storage
temperatures should be held between 15^OC and
60^OC.
Substrate: Depending upon the particular
component, the circuit material has an x and y
coefficient of thermal expansion of between 17 and
25 ppm/°C. This coefficient minimizes solder joint
stresses due to similar expansion rates of most
commonly used board substrates such as RF35,
RO4003, FR4, polyimide and G-10 materials.
Mounting to “hard” substrates (alumina etc.) is
possible depending upon operational temperature
requirements. The solder surfaces of the coupler
are all copper plated with either an immersion tin or
tin-lead exterior finish.
.170
[4.32]
.120
[3.05]
Solder Paste: All conventional solder paste
formulations will work well with Anaren’s Xinger III
surface mount components. Solder paste can be
applied with stencils or syringe dispensers. An
example of a stenciled solder paste deposit is
shown in Figure 2. As shown in the figure solder
paste is applied to the four RF pads and the entire
ground plane underneath the body of the part.
4x .034
[0.86]
4x 50
Transmission
Line
Dimensions are in Inches [Millimeters]
X3C07P1-04S Mounting Footprint
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Manufacturing.