X3C09P1-05S Datasheet, PDF (12/17 Pages) Anaren Microwave – Production Friendly

Model X3C09P1-05S
Prelim
Reflow: The surface mount coupler is conducive to most of
today’s conventional reflow methods. Low and high
temperature thermal reflow profiles are shown in Figures 6
and 7, respectively. Manual soldering of these components
can be done with conventional surface mount non-contact
hot air soldering tools. Board pre-heating is highly
recommended for these selective hot air soldering
methods. Manual soldering with conventional irons should
be avoided.
Figure 3: Solder Paste Application
Coupler Positioning: The surface mount coupler can
be placed manually or with automatic pick and place
mechanisms. Couplers should be placed (see Figure 4
and 5) onto wet paste with common surface mount
techniques and parameters. Pick and place systems
must supply adequate vacuum to hold a 0.50-0.55
gram coupler.
Figure 4: Component Placement
Figure 5: Mounting Features Example
USA/Canada:
Toll Free:
Europe:
[phone]
[phone]
[phone]
Available on Tape and
Reel for Pick and Place
Manufacturing.